AX500-2FGG676I

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 199 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2FGG676I – Axcelerator FPGA, 336 I/Os, 73,728-bit Embedded RAM, 676-BGA

The AX500-2FGG676I from Microchip Technology is an Axcelerator family Field Programmable Gate Array (FPGA) device built on the AX architecture and CMOS antifuse programming technology. It delivers a nonvolatile, single-chip solution with up to 500,000 equivalent system gates, high system and internal performance, and flexible multi-standard I/Os.

Designed for I/O‑rich and performance‑sensitive embedded systems, this industrial‑grade device targets applications that require deterministic timing, secure in-system programming, and a broad set of configurable I/O standards.

Key Features

  • Core Capacity and Logic — 500,000 equivalent system gates and 8,064 logic elements provide substantial programmable logic for mid-density FPGA designs.
  • Embedded Memory and FIFOs — Approximately 73,728 bits of embedded SRAM organized as variable-aspect 4,608‑bit RAM blocks with programmable FIFO control logic for buffering and data staging.
  • I/O Count and Performance — 336 user I/Os with support for high-speed differential signalling (LVDS up to 700 Mb/s) and bank-selectable, mixed-voltage operation across 1.5V, 1.8V, 2.5V and 3.3V domains.
  • High Performance Timing — System performance cited at 350+ MHz and internal performance at 500+ MHz, with segmentable clock resources and deterministic, user‑controllable timing.
  • Embedded PLLs — On-chip PLLs accepting 14–200 MHz inputs and capable of frequency synthesis up to 1 GHz for flexible clocking and clock-domain management.
  • Nonvolatile Antifuse Technology & Security — CMOS antifuse programming provides a single‑chip, nonvolatile configuration; FuseLock™ programming technology protects against reverse engineering and design theft.
  • System Diagnostics and Test — In-system diagnostic and debug capability with Microchip Silicon Explorer II and boundary-scan testing compliant with IEEE 1149.1 (JTAG).
  • Package and Power — Supplied in a 676‑BGA (676‑FBGA, 27 × 27) surface-mount package; core supply voltage range 1.425 V to 1.575 V.
  • Industrial Temperature Range — Rated for operation from −40 °C to +85 °C and RoHS‑compliant.

Typical Applications

  • High‑Speed Communications — Implement protocol bridging, lane aggregation or custom PHY interfaces using abundant I/Os and LVDS capable channels.
  • Embedded Data Acquisition and Processing — Use embedded SRAM blocks and programmable FIFOs for deterministic buffering and high‑throughput data paths.
  • Industrial Control and Automation — Leverage deterministic timing, segmentable clocks and industrial temperature rating for control, motor drive interfacing or deterministic I/O sequencing.
  • Secure, Tamper‑Resistant Designs — Antifuse nonvolatile configuration combined with FuseLock™ programming provides hardware-level security for intellectual property protection.

Unique Advantages

  • Single‑Chip Nonvolatile Solution: Antifuse technology eliminates the need for external configuration memory, simplifying board design and boot sequencing.
  • High Throughput Timing: Documented system and internal performance levels (350+ MHz / 500+ MHz) and PLL frequency synthesis support high-speed logic and data paths.
  • Flexible, Multi‑Standard I/Os: Bank‑selectable I/O voltages, programmable drive/slew and a wide range of supported single‑ended and differential standards enable mixed‑voltage system interfaces.
  • Embedded Memory with FIFO Control: Configurable SRAM blocks and dedicated FIFO logic reduce external memory requirements and simplify streaming designs.
  • Security and Testability: FuseLock™ programming plus JTAG boundary-scan and in-system diagnostics support secure deployment and post‑assembly validation.
  • Industrial‑Grade Operation: −40 °C to +85 °C rating and RoHS compliance make the device suitable for temperature-demanding industrial environments.

Why Choose AX500-2FGG676I?

The AX500-2FGG676I positions itself as a mid-density Axcelerator FPGA that balances substantial logic capacity, flexible high-speed I/O, and nonvolatile antifuse configuration. Its combination of 8,064 logic elements, approximately 73,728 bits of embedded SRAM, and 336 user I/Os provides a compact, integrated solution for embedded systems that require deterministic timing, secure configuration, and a broad I/O feature set.

Engineers designing industrial and communications equipment can rely on the AX500-2FGG676I for secure in-system programmability, robust clocking options via embedded PLLs, and comprehensive diagnostic capabilities supported by Microchip’s Silicon Explorer II. The device’s package and voltage specifications enable straightforward integration on surface-mount PCBs.

Request a quote or submit an availability inquiry to receive pricing, lead-time and ordering information for the AX500-2FGG676I.

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