AX500-2FG484I

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

Quantity 1,324 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2FG484I – Field Programmable Gate Array, 317 I/Os, 484-BGA

The AX500-2FG484I Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology is a single-chip, nonvolatile antifuse FPGA built on the AX architecture. It delivers up to 500,000 equivalent system gates with 8,064 logic elements and approximately 73,728 bits of embedded RAM, targeting high-performance, deterministic embedded logic implementations.

Designed for industrial use, the device offers 317 user I/Os in a 484-ball fine-pitch BGA (23 × 23) package, a 1.425–1.575 V core supply range and an operating temperature range of −40 °C to 85 °C—making it suitable for demanding embedded and communications applications that require reliable, long-term configuration.

Key Features

  • Core & Architecture  Antifuse-based Axcelerator (AX) architecture providing a single-chip, nonvolatile solution with FuseLock programming technology to protect designs from reverse engineering.
  • Logic Capacity  Approximately 500,000 equivalent system gates implemented as 8,064 logic elements to support complex custom logic and control functions.
  • Embedded Memory & FIFOs  Approximately 73,728 bits of embedded RAM with variable-aspect RAM blocks and programmable embedded FIFO control logic for buffering and data management.
  • I/O Flexibility  317 user I/Os with multi-standard, bank-selectable operation; LVDS-capable channels supporting high-speed differential signaling up to 700 Mb/s as stated in the device family documentation.
  • Performance & Timing  System-level performance characteristics cited for the Axcelerator family include 350+ MHz system performance and 500+ MHz internal performance, with segmentable clock resources and embedded PLLs providing frequency synthesis up to 1 GHz.
  • Power & Voltage  Low-voltage core operation with a specified supply range of 1.425 V to 1.575 V to support power-sensitive designs.
  • Package & Mounting  484-ball fine-pitch BGA (484-FPBGA, 23 × 23) surface-mount package for compact board-level integration.
  • Industrial Grade & Temperature  Industrial-grade device with an operating range of −40 °C to 85 °C for deployment in industrial environments.
  • Diagnostics & Test  In-system diagnostic and debug capability with Microchip Silicon Explorer II and boundary-scan testing compliant with IEEE 1149.1 (JTAG) as detailed in the product family documentation.
  • Compliance  RoHS-compliant manufacturing and lead-free packaging options consistent with industry environmental requirements.

Typical Applications

  • High-Speed Data Interfacing  Use the device’s LVDS-capable I/Os and high-performance internal timing for high-speed serial and parallel data interfaces requiring deterministic timing.
  • Embedded Packet Buffering and FIFO Control  Leverage the programmable embedded FIFO control logic and on-chip RAM blocks for data buffering in communication and streaming applications.
  • Industrial Control and Automation  Industrial-grade temperature range and robust single-chip nonvolatile configuration make the FPGA suitable for control logic, motor control sequencing, and machine interface tasks.
  • Custom Protocol and Interface Bridging  Reconfigure logic elements to implement protocol conversion or custom interface functions while using the device’s PLLs and clock segmentation for accurate timing.

Unique Advantages

  • Single-Chip, Nonvolatile Configuration: Antifuse-based, one-time programmable architecture provides permanent configuration without external configuration memory.
  • Deterministic Timing and High Internal Speed: Family-documented internal performance and segmentable clocks enable predictable timing closure for latency-sensitive logic.
  • Flexible, Multi-Standard I/Os: Bank-selectable I/O voltages and support for both single-ended and differential standards allow interface flexibility across mixed-voltage systems.
  • Embedded FIFO and Memory Control: On-chip RAM blocks with programmable FIFO logic simplify buffering and reduce external memory requirements.
  • Industrial Temperature Range: −40 °C to 85 °C rating supports deployment in a wide range of industrial environments.
  • Design Protection: FuseLock programming technology provides protection against reverse engineering and design theft as described for the device family.

Why Choose AX500-2FG484I?

The AX500-2FG484I combines a substantial logic capacity—approximately 500,000 equivalent system gates and 8,064 logic elements—with embedded memory and FIFO control to address complex, high-throughput embedded designs. Its antifuse, single-chip, nonvolatile configuration model reduces system-level BOM and delivers stable, tamper-resistant implementations.

With industrial temperature capability, a compact 484-FPBGA package, deterministic timing resources including PLLs and segmentable clocks, and flexible I/O standards, this Axcelerator FPGA is positioned for engineers and procurement teams designing robust communication, control, and interface-centric systems that require reliable long-term configuration and high internal performance.

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