AX500-2FG484
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA |
|---|---|
| Quantity | 412 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-2FG484 – Axcelerator FPGA, 500,000 gates, 484-BGA
The AX500-2FG484 is an Axcelerator Field Programmable Gate Array (FPGA) IC built on Microchip’s AX architecture and antifuse programming technology. This single-chip, nonvolatile FPGA delivers high internal performance and on-chip embedded memory and FIFO resources, suited for designs that require deterministic timing, design security and high-speed I/O.
Key attributes of the device include approximately 500,000 equivalent system gates, 8,064 logic elements, 73,728 bits of embedded RAM, 317 user I/Os and a 484-ball FPBGA package. The device is targeted to commercial-grade applications with a specified operating range of 0 °C to 70 °C and a core supply range of 1.425 V to 1.575 V.
Key Features
- Core architecture — AX architecture with antifuse programming provides a single-chip, nonvolatile solution and deterministic, user-controllable timing for secure and stable designs.
- Logic capacity — Approximately 500,000 gates implemented as 8,064 logic elements, enabling mid-density programmable logic integration on a single device.
- Embedded memory and FIFO — 73,728 bits of on-chip RAM with dedicated FIFO control logic for buffering and data-stream handling.
- High-performance clocking — Segmentable clock resources and embedded PLLs support system and internal clock synthesis and deterministic timing control.
- High-speed I/Os — 317 user I/Os with support for multiple voltage standards and LVDS-capable channels up to the family’s documented rates; bank-selectable mixed-voltage operation enables flexible interface design.
- Performance characteristics — Family-level documented system performance exceeding 350 MHz and internal performance over 500 MHz (family datasheet figures).
- Power and package — Low-voltage core operation (1.425 V–1.575 V) in a 484-FPBGA surface-mount package (23 × 23 mm ball array), RoHS-compliant.
- Design security — Antifuse-based FuseLock programming technology protects against reverse engineering and design theft as described in the Axcelerator family documentation.
Typical Applications
- High-speed data interfacing — Use the device’s LVDS-capable I/Os and embedded FIFOs to implement high-throughput serial links and front-end data aggregation.
- Real-time protocol conversion — Deterministic timing, on-chip RAM and programmable logic allow implementation of protocol bridges and packet buffering with tight timing control.
- Custom control and glue logic — Mid-density logic capacity and flexible I/O voltage banks make the device suitable for consolidating control functions and board-level glue logic.
Unique Advantages
- Nonvolatile, antifuse-based security — Built-in FuseLock programming technology provides protection against reverse engineering and design theft.
- Deterministic performance — User-controllable timing and segmentable clock resources support designs that require repeatable, deterministic timing behavior.
- Integrated FIFO and embedded RAM — On-chip RAM and FIFO control logic simplify streaming data designs and reduce external memory requirements.
- Flexible I/O with mixed-voltage banks — Bank-selectable I/O voltage support enables interfaces to multiple logic families without external level-shifting.
- Compact, surface-mount package — 484-FPBGA (23 × 23 mm) packaging provides a surface-mount, high-pin-count solution for space-constrained designs.
Why Choose AX500-2FG484?
The AX500-2FG484 combines mid-range logic capacity with embedded memory, high-speed I/O capability and antifuse nonvolatile programming to address designs that require secure, deterministic, high-performance programmable logic. Its core voltage range, commercial temperature grade and 484-ball FPBGA packaging make it suitable for a wide range of commercial embedded applications that need integrated FIFO buffering, flexible I/O standards and reliable timing.
This device is well suited for engineers and teams building communication interfaces, data acquisition front ends, protocol bridges and consolidated control logic who value on-chip memory and security features together with the performance characteristics documented for the Axcelerator family.
Request a quote or submit an inquiry to our sales team to discuss availability, pricing and support for integrating the AX500-2FG484 into your next design.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D