AX500-2FG484

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

Quantity 412 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2FG484 – Axcelerator FPGA, 500,000 gates, 484-BGA

The AX500-2FG484 is an Axcelerator Field Programmable Gate Array (FPGA) IC built on Microchip’s AX architecture and antifuse programming technology. This single-chip, nonvolatile FPGA delivers high internal performance and on-chip embedded memory and FIFO resources, suited for designs that require deterministic timing, design security and high-speed I/O.

Key attributes of the device include approximately 500,000 equivalent system gates, 8,064 logic elements, 73,728 bits of embedded RAM, 317 user I/Os and a 484-ball FPBGA package. The device is targeted to commercial-grade applications with a specified operating range of 0 °C to 70 °C and a core supply range of 1.425 V to 1.575 V.

Key Features

  • Core architecture — AX architecture with antifuse programming provides a single-chip, nonvolatile solution and deterministic, user-controllable timing for secure and stable designs.
  • Logic capacity — Approximately 500,000 gates implemented as 8,064 logic elements, enabling mid-density programmable logic integration on a single device.
  • Embedded memory and FIFO — 73,728 bits of on-chip RAM with dedicated FIFO control logic for buffering and data-stream handling.
  • High-performance clocking — Segmentable clock resources and embedded PLLs support system and internal clock synthesis and deterministic timing control.
  • High-speed I/Os — 317 user I/Os with support for multiple voltage standards and LVDS-capable channels up to the family’s documented rates; bank-selectable mixed-voltage operation enables flexible interface design.
  • Performance characteristics — Family-level documented system performance exceeding 350 MHz and internal performance over 500 MHz (family datasheet figures).
  • Power and package — Low-voltage core operation (1.425 V–1.575 V) in a 484-FPBGA surface-mount package (23 × 23 mm ball array), RoHS-compliant.
  • Design security — Antifuse-based FuseLock programming technology protects against reverse engineering and design theft as described in the Axcelerator family documentation.

Typical Applications

  • High-speed data interfacing — Use the device’s LVDS-capable I/Os and embedded FIFOs to implement high-throughput serial links and front-end data aggregation.
  • Real-time protocol conversion — Deterministic timing, on-chip RAM and programmable logic allow implementation of protocol bridges and packet buffering with tight timing control.
  • Custom control and glue logic — Mid-density logic capacity and flexible I/O voltage banks make the device suitable for consolidating control functions and board-level glue logic.

Unique Advantages

  • Nonvolatile, antifuse-based security — Built-in FuseLock programming technology provides protection against reverse engineering and design theft.
  • Deterministic performance — User-controllable timing and segmentable clock resources support designs that require repeatable, deterministic timing behavior.
  • Integrated FIFO and embedded RAM — On-chip RAM and FIFO control logic simplify streaming data designs and reduce external memory requirements.
  • Flexible I/O with mixed-voltage banks — Bank-selectable I/O voltage support enables interfaces to multiple logic families without external level-shifting.
  • Compact, surface-mount package — 484-FPBGA (23 × 23 mm) packaging provides a surface-mount, high-pin-count solution for space-constrained designs.

Why Choose AX500-2FG484?

The AX500-2FG484 combines mid-range logic capacity with embedded memory, high-speed I/O capability and antifuse nonvolatile programming to address designs that require secure, deterministic, high-performance programmable logic. Its core voltage range, commercial temperature grade and 484-ball FPBGA packaging make it suitable for a wide range of commercial embedded applications that need integrated FIFO buffering, flexible I/O standards and reliable timing.

This device is well suited for engineers and teams building communication interfaces, data acquisition front ends, protocol bridges and consolidated control logic who value on-chip memory and security features together with the performance characteristics documented for the Axcelerator family.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing and support for integrating the AX500-2FG484 into your next design.

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