AX500-1PQ208M

IC FPGA 115 I/O 208QFP
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 115 73728 208-BFQFP

Quantity 704 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case208-BFQFPNumber of I/O115Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-1PQ208M – Axcelerator FPGA, 115 I/Os, approximately 0.074 Mbits RAM, 208-BFQFP

The AX500-1PQ208M is an Axcelerator antifuse Field Programmable Gate Array (FPGA) delivering 500,000 equivalent system gates and 8,064 logic elements in a 208-BFQFP surface-mount package. Built for secure, high-performance embedded designs, the device combines nonvolatile antifuse programming, embedded SRAM/FIFO control logic and on-chip PLLs to enable deterministic timing and system-level integration.

With a 1.5 V core supply range (1.425 V to 1.575 V), 115 user I/Os, and a wide operating temperature range from −55 °C to 125 °C, this military-grade FPGA targets applications that require robust operation across demanding environments and secure, one-time programmable logic.

Key Features

  • Core Capacity  Approximately 500,000 equivalent system gates and 8,064 logic elements provide significant logic density for complex control and signal-processing functions.
  • Embedded Memory  Total on-chip RAM of 73,728 bits (approximately 0.074 Mbits) with embedded FIFO control logic and variable-aspect RAM blocks for flexible data buffering and storage.
  • I/O and Interface Capability  115 user I/Os with support for high-speed differential interfaces; datasheet indicates LVDS-capable I/Os up to 700 Mb/s and multi-standard, bank-selectable I/O operation across common voltage standards.
  • Performance & Clocking  System performance targets above 350 MHz with internal paths exceeding 500 MHz; segmentable clock resources and on-chip PLLs (frequency synthesis up to 1 GHz) enable precise clock management and high-speed timing.
  • Nonvolatile Antifuse Technology  Single-chip, nonvolatile antifuse implementation with FuseLock programming technology to protect against reverse engineering and provide secure, permanent configuration.
  • Power  1.425 V to 1.575 V core supply (1.5 V nominal) designed for low-power core operation while supporting mixed-voltage I/O banks.
  • Package & Mounting  208-BFQFP (supplier package 208-PQFP 28 × 28) surface-mount package suitable for compact board-level integration.
  • Environmental & Compliance  Military-grade device with an operating range of −55 °C to 125 °C and RoHS-compliant status for environmental compatibility.

Typical Applications

  • Defense and military systems  Deploys nonvolatile antifuse configuration and wide temperature tolerance for secure, reliable logic in mission-critical, harsh-environment electronics.
  • High-speed data interfaces  Use embedded FIFOs, PLLs and LVDS-capable I/Os to implement high-bandwidth serial links and buffered data paths.
  • Communications and networking modules  On-chip RAM blocks, deterministic timing and high internal performance support frame buffering, packet processing and protocol offload tasks.
  • Secure, one-time-programmable control logic  FuseLock and antifuse programming provide hardware-level protection for IP and irreversible configuration needs.

Unique Advantages

  • Secure nonvolatile configuration: Antifuse programming combined with FuseLock technology protects design IP and prevents reverse engineering.
  • Deterministic, high-speed operation: Segmentable clocks, on-chip PLLs and internal performance beyond 500 MHz enable tightly controlled, high-frequency designs.
  • Integrated memory and FIFO control: Dedicated embedded RAM blocks and programmable FIFO logic reduce external memory requirements and simplify data buffering.
  • Flexible mixed-voltage I/Os: Bank-selectable I/O standards and support for differential interfaces like LVDS allow interfacing with a wide range of external devices and signaling levels.
  • Rugged thermal range: Military-grade operation from −55 °C to 125 °C supports deployment in extreme-temperature environments.
  • Compact package integration: 208-BFQFP surface-mount packaging enables high-density board designs while maintaining robust connectivity.

Why Choose AX500-1PQ208M?

The AX500-1PQ208M combines a large logic fabric (approximately 500,000 gates and 8,064 logic elements) with secure, nonvolatile antifuse technology and embedded SRAM/FIFO resources to deliver a compact, reliable platform for demanding embedded applications. Its military-grade temperature range and RoHS compliance make it suitable for long-life programs that require both environmental robustness and secure configuration.

This device is well suited for engineering teams building secure communications, data-interface, and mission-critical control systems who need deterministic timing, integrated memory resources, and hardware-level protection for design assets.

Request a quote or submit a purchase inquiry to evaluate AX500-1PQ208M for your next secure, high-performance FPGA design.

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