AX500-1FGG676M

The AX500-1FGG676M is an Axcelerator antifuse FPGA built on Microchip's AX architecture. This single-chip, nonvolatile FPGA combines high-performance logic, embedded memory and flexible I/O to address rugged and security-sensitive applications.

Designed for military-grade systems, the device provides 500,000 equivalent system gates, 8,064 logic elements and approximately 0.074 Mbits of embedded RAM, along with a wide operating temperature range and a 676-ball FBGA package.

Key Features

• Core & Architecture — Antifuse AXcelerator architecture delivering a single-chip, nonvolatile solution with deterministic, user-controllable timing and FuseLock programming technology for protection against reverse engineering.
• Logic Resources — 8,064 logic elements (cells) and 500,000 equivalent system gates to implement complex logic and control functions.
• Embedded Memory & FIFOs — Approximately 73,728 bits (≈0.074 Mbits) of on-chip RAM with embedded FIFO control logic and variable-aspect RAM block organizations for flexible data buffering.
• I/O & Interfaces — 336 user I/Os with support for high-speed differential signaling; series-level LVDS capability up to 700 Mb/s and bank-selectable, mixed-voltage I/O operation (1.5V, 1.8V, 2.5V, 3.3V).
• Performance — Series-level system performance up to 350+ MHz and internal performance up to 500+ MHz, with segmentable clocks and embedded PLLs offering frequency synthesis.
• Power & Voltage — Core supply specified at 1.425 V to 1.575 V (1.5 V nominal) for the device core.
• Package & Mounting — 676-ball FBGA supplier package (27 × 27), 676-BGA package case; surface-mount mounting type for PCB assembly.
• Temperature & Grade — Military-grade device rated for operation from −55 °C to 125 °C.

Typical Applications

• Military and Defense Systems — Deployable in rugged, temperature-extreme environments where military-grade components and nonvolatile configuration are required.
• High-Speed Data Interfaces — Suitable for designs requiring LVDS-capable I/Os and high internal clock rates for data capture, serialization and routing.
• Secure and IP-Sensitive Designs — FuseLock programming and antifuse technology protect designs against reverse engineering and unauthorized access.
• Embedded Processing and Control — Use as a programmable logic element for system control, protocol handling and custom processing in compact, single-chip implementations.

Unique Advantages

• Nonvolatile, Single-Chip Solution: Antifuse architecture preserves configuration without external memory, simplifying system design and boot behavior.
• Security Features: FuseLock programming technology provides protection against reverse engineering and design theft for IP-sensitive applications.
• Deterministic Timing and Performance: Segmentable clocks, embedded PLLs and user-controllable timing enable predictable high-speed operation up to series-indicated levels.
• Flexible, High-Speed I/O: Bank-selectable mixed-voltage I/Os and LVDS-capable channels support a wide range of interface standards and high data rates.
• Rugged Operational Range: Military-grade temperature specification (−55 °C to 125 °C) supports deployment in harsh environmental conditions.
• Compact, Assembly-Ready Package: 676-ball FBGA (27 × 27) in a surface-mount form factor enables high-density PCB integration.

Why Choose AX500-1FGG676M?

The AX500-1FGG676M positions itself as a high-performance, secure FPGA option for designs that require nonvolatile configuration, deterministic timing and robust environmental capability. With 8,064 logic elements, 336 user I/Os, and embedded RAM/FIFO support, it is well-suited to systems that need compact, reconfigurable logic with protection against reverse engineering.

Engineers and procurement teams looking for a military-grade FPGA with a 676-ball FBGA package, 1.5 V core supply window and wide operating temperature range will find the AX500-1FGG676M a practical platform for long-lived, secure and high-performance embedded designs.

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