AX500-1FGG676I

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 407 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-1FGG676I – Axcelerator FPGA IC, 336 I/Os, 676-FBGA (Industrial)

The AX500-1FGG676I is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology, built on the antifuse-based AX architecture. This single-chip, nonvolatile FPGA combines high internal performance, embedded RAM/FIFO control logic and flexible multi-standard I/Os to address demanding industrial designs that require deterministic timing, secure programming and robust I/O options.

Key Features

  • Logic Capacity – 8,064 logic elements providing a hardware resource set equivalent to 500,000 gates for mid-range FPGA designs.
  • Embedded Memory – 73,728 total bits of on-chip RAM (embedded SRAM/FIFO) with configurable block organizations and programmable FIFO control logic.
  • I/O Density & Standards – 336 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL.
  • Performance – Family-level performance guidance including 350+ MHz system performance and 500+ MHz internal performance for demanding timing requirements.
  • Programmable Clocking & PLL – Segmentable clock resources and an embedded PLL with a 14–200 MHz input range and frequency synthesis capability up to 1 GHz.
  • Nonvolatile Antifuse Technology – Antifuse-based single-chip solution with FuseLock programming technology to protect against reverse engineering and secure designs.
  • Package & Mounting – 676-FBGA (27 × 27 mm) package; surface-mount mounting type suitable for industrial PCBs.
  • Power & Temperature – Core supply range 1.425 V to 1.575 V and rated for industrial operation from −40 °C to +85 °C.
  • Design-for-Test & Debug – Boundary-scan (IEEE 1149.1/JTAG) and in-system diagnostic capability with Microchip Silicon Explorer II (family feature).
  • Standards & Flexibility – Bank-selectable I/Os (8 banks per chip), programmable slew rate/drive strength and input pull options for board-level signal integrity tuning.
  • Regulatory – RoHS compliant.

Typical Applications

  • Industrial Control & Automation – Deterministic timing, industrial temperature rating, and nonvolatile antifuse programming make the device well-suited for control logic, sequencing and safety-related modules.
  • High-Speed Serial & Communication Interfaces – LVDS-capable I/Os and embedded PLLs support high-speed data paths and protocol bridging in communications equipment.
  • Embedded Memory-Intensive Logic – Configurable embedded SRAM blocks and programmable FIFO control enable buffer-heavy designs such as data-acquisition front-ends and streaming interfaces.
  • Secure, One-Time Programmable Designs – Antifuse technology with FuseLock provides a nonvolatile, single-chip option where design security and IP protection are required.

Unique Advantages

  • Single-Chip, Nonvolatile Implementation: Eliminates external configuration memory by using antifuse programming for permanent on-chip configuration.
  • Secure Programming with FuseLock: Built-in protection against reverse engineering supports IP security for sensitive designs.
  • Flexible, Multi-Standard I/Os: Bank-selectable mixed-voltage operation and support for multiple single-ended and differential standards reduce the need for level-shifting components.
  • High Internal and System Performance: Family-specified 350+ MHz system and 500+ MHz internal performance allow timing headroom for demanding logic and data paths.
  • Embedded Memory & FIFO Support: Configurable RAM blocks and FIFO control logic simplify designs that require data buffering and width conversion.
  • Industrial Grade Reliability: Industrial temperature range (−40 °C to +85 °C) and a robust BGA package support deployment in industrial environments.

Why Choose AX500-1FGG676I?

The AX500-1FGG676I positions itself as a secure, mid-capacity Axcelerator FPGA option for industrial applications that require a nonvolatile, high-performance programmable device. With 8,064 logic elements, 73,728 bits of embedded memory, 336 I/Os and antifuse-based FuseLock protection, it delivers a balanced mix of logic resources, embedded storage and secure programming for robust system designs.

This part is appropriate for engineers seeking deterministic timing, flexible I/O standards and integrated PLL/clocking resources in an industrial-rated package. Its combination of on-chip memory, programmable FIFOs and high-speed I/O capability supports a range of embedded and communications-focused designs while minimizing external component count.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the AX500-1FGG676I. Our team can provide lead-time details and help with technical qualification for your design requirements.

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