AX500-1FGG676I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA |
|---|---|
| Quantity | 407 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 336 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-1FGG676I – Axcelerator FPGA IC, 336 I/Os, 676-FBGA (Industrial)
The AX500-1FGG676I is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology, built on the antifuse-based AX architecture. This single-chip, nonvolatile FPGA combines high internal performance, embedded RAM/FIFO control logic and flexible multi-standard I/Os to address demanding industrial designs that require deterministic timing, secure programming and robust I/O options.
Key Features
- Logic Capacity – 8,064 logic elements providing a hardware resource set equivalent to 500,000 gates for mid-range FPGA designs.
- Embedded Memory – 73,728 total bits of on-chip RAM (embedded SRAM/FIFO) with configurable block organizations and programmable FIFO control logic.
- I/O Density & Standards – 336 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL.
- Performance – Family-level performance guidance including 350+ MHz system performance and 500+ MHz internal performance for demanding timing requirements.
- Programmable Clocking & PLL – Segmentable clock resources and an embedded PLL with a 14–200 MHz input range and frequency synthesis capability up to 1 GHz.
- Nonvolatile Antifuse Technology – Antifuse-based single-chip solution with FuseLock programming technology to protect against reverse engineering and secure designs.
- Package & Mounting – 676-FBGA (27 × 27 mm) package; surface-mount mounting type suitable for industrial PCBs.
- Power & Temperature – Core supply range 1.425 V to 1.575 V and rated for industrial operation from −40 °C to +85 °C.
- Design-for-Test & Debug – Boundary-scan (IEEE 1149.1/JTAG) and in-system diagnostic capability with Microchip Silicon Explorer II (family feature).
- Standards & Flexibility – Bank-selectable I/Os (8 banks per chip), programmable slew rate/drive strength and input pull options for board-level signal integrity tuning.
- Regulatory – RoHS compliant.
Typical Applications
- Industrial Control & Automation – Deterministic timing, industrial temperature rating, and nonvolatile antifuse programming make the device well-suited for control logic, sequencing and safety-related modules.
- High-Speed Serial & Communication Interfaces – LVDS-capable I/Os and embedded PLLs support high-speed data paths and protocol bridging in communications equipment.
- Embedded Memory-Intensive Logic – Configurable embedded SRAM blocks and programmable FIFO control enable buffer-heavy designs such as data-acquisition front-ends and streaming interfaces.
- Secure, One-Time Programmable Designs – Antifuse technology with FuseLock provides a nonvolatile, single-chip option where design security and IP protection are required.
Unique Advantages
- Single-Chip, Nonvolatile Implementation: Eliminates external configuration memory by using antifuse programming for permanent on-chip configuration.
- Secure Programming with FuseLock: Built-in protection against reverse engineering supports IP security for sensitive designs.
- Flexible, Multi-Standard I/Os: Bank-selectable mixed-voltage operation and support for multiple single-ended and differential standards reduce the need for level-shifting components.
- High Internal and System Performance: Family-specified 350+ MHz system and 500+ MHz internal performance allow timing headroom for demanding logic and data paths.
- Embedded Memory & FIFO Support: Configurable RAM blocks and FIFO control logic simplify designs that require data buffering and width conversion.
- Industrial Grade Reliability: Industrial temperature range (−40 °C to +85 °C) and a robust BGA package support deployment in industrial environments.
Why Choose AX500-1FGG676I?
The AX500-1FGG676I positions itself as a secure, mid-capacity Axcelerator FPGA option for industrial applications that require a nonvolatile, high-performance programmable device. With 8,064 logic elements, 73,728 bits of embedded memory, 336 I/Os and antifuse-based FuseLock protection, it delivers a balanced mix of logic resources, embedded storage and secure programming for robust system designs.
This part is appropriate for engineers seeking deterministic timing, flexible I/O standards and integrated PLL/clocking resources in an industrial-rated package. Its combination of on-chip memory, programmable FIFOs and high-speed I/O capability supports a range of embedded and communications-focused designs while minimizing external component count.
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