AX500-1FGG484I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA |
|---|---|
| Quantity | 662 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-1FGG484I – Axcelerator Field Programmable Gate Array (FPGA), 484-BGA, 317 I/Os
The AX500-1FGG484I is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture and an advanced 0.15 μm CMOS antifuse process with seven layers of metal. It delivers a nonvolatile, single-chip programmable solution with about 500,000 equivalent system gates and embedded SRAM, designed for industrial-temperature applications.
Engineered for system-level integration, the device combines high internal performance and flexible I/O support—including LVDS-capable interfaces and embedded PLL resources—to address demanding embedded designs that require deterministic timing, in-system debug and secure configuration.
Key Features
- Core & Architecture Antifuse-based AX architecture implemented in advanced 0.15 μm CMOS with seven metal layers, providing a single-chip, nonvolatile programmable solution and FuseLock programming protection.
- Logic Capacity Approximately 500,000 equivalent system gates with 8,064 logic elements for mid-range FPGA logic integration.
- Embedded Memory 73,728 bits of on-chip SRAM (embedded RAM/FIFO) with variable-aspect RAM blocks and programmable FIFO control logic.
- I/O and Interfaces 317 user I/Os with support for mixed voltage operation and bank-selectable I/Os. I/Os are LVDS-capable up to 700 Mb/s and support programmable slew rate, drive strength and registered I/Os.
- Clocking and PLLs Segmentable clock resources and on-chip phase-locked loops (8 PLLs for AX500 family) with a 14–200 MHz input range and frequency synthesis up to 1 GHz.
- Performance System-level performance targets cited in family documentation include 350+ MHz system performance and 500+ MHz internal performance.
- Package & Mounting 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) surface-mount package, suited for space-efficient board designs.
- Industrial Grade & Environmental Industrial operating range of −40 °C to 85 °C and RoHS-compliant packaging. Core supply voltage specified at 1.425 V to 1.575 V.
Typical Applications
- Industrial Control — Deterministic timing, on-chip memory and industrial temperature rating make the device suitable for control logic, protocol bridging and real-time processing in industrial systems.
- High-Speed Interface Bridging — LVDS-capable I/Os and programmable I/O characteristics enable high-speed serial links and interface adaptation between mixed-voltage domains.
- Data Buffering and FIFO Management — Embedded SRAM with programmable FIFO control logic supports buffering and data-path staging in communication or data-acquisition subsystems.
Unique Advantages
- Nonvolatile, Single-Chip Solution: Antifuse technology provides a one-time programmable, nonvolatile configuration that eliminates the need for external configuration memory.
- Deterministic Performance: Segmentable clocks and dedicated PLLs with frequency synthesis deliver user-controllable timing for predictable system behavior.
- Flexible, High-Speed I/O: Bank-selectable, mixed-voltage I/Os and LVDS support up to 700 Mb/s allow interfacing across multiple standards without external level translators.
- Embedded Memory with FIFO Control: On-chip SRAM and programmable FIFO logic reduce external memory requirements and simplify high-throughput data paths.
- Industrial Temperature Rating: Qualified for −40 °C to 85 °C operation to meet typical industrial environmental needs.
- Compact Package: Fine-pitch 484-BGA (23 × 23) enables a dense board footprint while providing a large I/O count.
Why Choose AX500-1FGG484I?
The AX500-1FGG484I positions itself as a high-performance, nonvolatile FPGA option for engineers who need a blend of logic capacity, embedded memory and flexible high-speed I/O in an industrial-temperature device. With approximately 500,000 equivalent system gates, 8,064 logic elements and embedded SRAM, it supports complex mid-range designs while reducing external BOM through on-chip resources.
This device is well suited to customers building robust, long-lived systems that require deterministic timing, secure configuration and mixed-voltage interfacing. Backed by Microchip’s Axcelerator architecture and antifuse programming, the AX500-1FGG484I offers a scalable choice for designs where nonvolatile configuration and reliable industrial operation are priorities.
Request a quote or submit an inquiry to get pricing, lead-time information and support for integrating the AX500-1FGG484I into your design.

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