AX500-1FGG484I

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

Quantity 662 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-1FGG484I – Axcelerator Field Programmable Gate Array (FPGA), 484-BGA, 317 I/Os

The AX500-1FGG484I is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture and an advanced 0.15 μm CMOS antifuse process with seven layers of metal. It delivers a nonvolatile, single-chip programmable solution with about 500,000 equivalent system gates and embedded SRAM, designed for industrial-temperature applications.

Engineered for system-level integration, the device combines high internal performance and flexible I/O support—including LVDS-capable interfaces and embedded PLL resources—to address demanding embedded designs that require deterministic timing, in-system debug and secure configuration.

Key Features

  • Core & Architecture Antifuse-based AX architecture implemented in advanced 0.15 μm CMOS with seven metal layers, providing a single-chip, nonvolatile programmable solution and FuseLock programming protection.
  • Logic Capacity Approximately 500,000 equivalent system gates with 8,064 logic elements for mid-range FPGA logic integration.
  • Embedded Memory 73,728 bits of on-chip SRAM (embedded RAM/FIFO) with variable-aspect RAM blocks and programmable FIFO control logic.
  • I/O and Interfaces 317 user I/Os with support for mixed voltage operation and bank-selectable I/Os. I/Os are LVDS-capable up to 700 Mb/s and support programmable slew rate, drive strength and registered I/Os.
  • Clocking and PLLs Segmentable clock resources and on-chip phase-locked loops (8 PLLs for AX500 family) with a 14–200 MHz input range and frequency synthesis up to 1 GHz.
  • Performance System-level performance targets cited in family documentation include 350+ MHz system performance and 500+ MHz internal performance.
  • Package & Mounting 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) surface-mount package, suited for space-efficient board designs.
  • Industrial Grade & Environmental Industrial operating range of −40 °C to 85 °C and RoHS-compliant packaging. Core supply voltage specified at 1.425 V to 1.575 V.

Typical Applications

  • Industrial Control — Deterministic timing, on-chip memory and industrial temperature rating make the device suitable for control logic, protocol bridging and real-time processing in industrial systems.
  • High-Speed Interface Bridging — LVDS-capable I/Os and programmable I/O characteristics enable high-speed serial links and interface adaptation between mixed-voltage domains.
  • Data Buffering and FIFO Management — Embedded SRAM with programmable FIFO control logic supports buffering and data-path staging in communication or data-acquisition subsystems.

Unique Advantages

  • Nonvolatile, Single-Chip Solution: Antifuse technology provides a one-time programmable, nonvolatile configuration that eliminates the need for external configuration memory.
  • Deterministic Performance: Segmentable clocks and dedicated PLLs with frequency synthesis deliver user-controllable timing for predictable system behavior.
  • Flexible, High-Speed I/O: Bank-selectable, mixed-voltage I/Os and LVDS support up to 700 Mb/s allow interfacing across multiple standards without external level translators.
  • Embedded Memory with FIFO Control: On-chip SRAM and programmable FIFO logic reduce external memory requirements and simplify high-throughput data paths.
  • Industrial Temperature Rating: Qualified for −40 °C to 85 °C operation to meet typical industrial environmental needs.
  • Compact Package: Fine-pitch 484-BGA (23 × 23) enables a dense board footprint while providing a large I/O count.

Why Choose AX500-1FGG484I?

The AX500-1FGG484I positions itself as a high-performance, nonvolatile FPGA option for engineers who need a blend of logic capacity, embedded memory and flexible high-speed I/O in an industrial-temperature device. With approximately 500,000 equivalent system gates, 8,064 logic elements and embedded SRAM, it supports complex mid-range designs while reducing external BOM through on-chip resources.

This device is well suited to customers building robust, long-lived systems that require deterministic timing, secure configuration and mixed-voltage interfacing. Backed by Microchip’s Axcelerator architecture and antifuse programming, the AX500-1FGG484I offers a scalable choice for designs where nonvolatile configuration and reliable industrial operation are priorities.

Request a quote or submit an inquiry to get pricing, lead-time information and support for integrating the AX500-1FGG484I into your design.

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