AX500-1FG676I

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 1,973 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-1FG676I – Axcelerator FPGA, 336 I/Os, approximately 0.074 Mbit embedded memory, 676-FBGA

The AX500-1FG676I is an Axcelerator family Field Programmable Gate Array (FPGA) IC built on Microchip Technology’s AX architecture and antifuse programming technology. It delivers a nonvolatile, single-chip FPGA solution designed for industrial-grade applications that require deterministic timing, design security, and compact packaging.

This device targets designs that demand high internal performance and flexible I/O integration: it combines 500,000 equivalent system gates, 8,064 logic elements, approximately 0.074 Mbits of embedded RAM, and 336 user I/Os in a 676-ball fine BGA (27 × 27 mm) package.

Key Features

  • Core Capacity — 500,000 equivalent system gates and 8,064 logic elements provide substantial programmable logic for mid‑range system functions and custom processing pipelines.
  • Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 0.074 Mbits) with embedded FIFO control logic and configurable RAM block organizations for flexible data buffering and packet staging.
  • I/O Flexibility — 336 user I/Os with support for multi-standard, bank-selectable voltages and differential/ single-ended signaling options as described for the Axcelerator family; includes high-speed LVDS-capable channels.
  • Performance — Family-level performance capabilities include 350+ MHz system performance and 500+ MHz internal performance to support high-throughput designs and timing-critical logic.
  • Clocking and PLLs — Segmentable clock resources and embedded PLLs with an input range supporting 14–200 MHz and frequency synthesis capabilities up to 1 GHz for flexible clock management.
  • Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock™ protection provides design security and resistance to reverse engineering.
  • Power and Supply — Specified core supply range of 1.425 V to 1.575 V consistent with a 1.5 V core; supports mixed-voltage I/O operation across supported standards for system interfacing.
  • Package & Temperature — 676-ball FBGA (27 × 27 mm) package (676-FBGA) and industrial-grade operating range from −40 °C to +85 °C for reliable operation in industrial environments.
  • Test & Debug — Supports boundary-scan testing (IEEE 1149.1 JTAG) and in-system diagnostic/debug capability as provided by the Axcelerator family tooling.
  • Standards & Interfaces — Family features include support for multiple I/O standards (LVTTL, LVCMOS, LVDS, LVPECL, GTL+, HSTL, SSTL2/3, PCI/PCI-X) and programmable output drive/slew settings for interface tuning.

Typical Applications

  • Industrial Control — Implement motor control, real-time sequencing, and protocol bridging where industrial temperature operation and deterministic timing are required.
  • High‑Speed Data Interfaces — Use the device’s LVDS-capable I/Os and embedded FIFOs for high-throughput serial data paths, stream buffering, and protocol conversion.
  • Secure Embedded Systems — Leverage antifuse nonvolatile programming and FuseLock protection for applications where design security and IP protection are priorities.
  • System Integration & Glue Logic — Consolidate multiple discrete functions into a single programmable device to reduce BOM and enable compact, footprint-compatible designs.

Unique Advantages

  • Nonvolatile Single‑Chip Solution: Antifuse programming removes the need for external configuration memory and provides immediate availability of the programmed design after power-up.
  • Design Security with FuseLock™: Built-in programming protection helps guard design IP against reverse engineering and unauthorized readout.
  • Deterministic, High Internal Performance: Family-level internal and system performance figures support timing-sensitive applications and high-clock-rate logic blocks.
  • Flexible, Multi‑Standard I/Os: Bank-selectable I/O voltages, differential/single-ended standards, and programmable drive/slew control enable direct interfacing to diverse peripherals and mezzanine cards.
  • Industrial Reliability: Specified operating range from −40 °C to +85 °C and a robust FBGA package make the device suitable for industrial deployments.
  • On‑Chip Memory and FIFO Support: Embedded RAM and FIFO control logic simplify data buffering and stream handling without external memory in many use cases.

Why Choose AX500-1FG676I?

AX500-1FG676I delivers a balanced combination of programmable logic capacity, embedded memory, flexible I/O, and nonvolatile antifuse security in an industrial-grade package. It is positioned for mid-range systems that require deterministic performance, secure in-field operation, and the ability to consolidate multiple functions onto a single FPGA.

This part is well suited to engineers designing industrial control systems, high-speed data interfaces, and secure embedded platforms who need a compact, reliable FPGA with proven family-level clocking, PLLs, and I/O flexibility. The Axcelerator family feature set provides scalability and in-system diagnostics to support development and long-term deployment.

Request a quote or submit an inquiry to begin sourcing AX500-1FG676I for your next industrial FPGA design.

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