AX500-1FG676M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA |
|---|---|
| Quantity | 64 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 336 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-1FG676M – Axcelerator FPGA, 336 I/Os, 73,728-bit Embedded RAM, 676-FBGA
The AX500-1FG676M is an Axcelerator family antifuse FPGA offering a single-chip, nonvolatile solution built on Microchip’s AX architecture. This device provides a combination of density (approximately 500,000 equivalent system gates and 8,064 logic elements), a broad I/O set (336 user I/Os), and embedded memory (73,728 bits) for high-performance, security-conscious designs.
Targeted for applications that require deterministic timing, secure programming and high-speed interfaces, the AX500-1FG676M delivers series-level capabilities such as high internal clock performance, embedded PLLs and bank-selectable multi-standard I/Os while supporting military-grade temperature and reliability requirements.
Key Features
- AX Antifuse Architecture & Nonvolatile Programming Single-chip antifuse technology with FuseLock programming protects against reverse engineering and provides one-time programmable, nonvolatile configuration.
- Logic Capacity Approximately 500,000 equivalent system gates implemented across 8,064 logic elements, enabling complex digital functions and high integration.
- Embedded Memory & FIFOs 73,728 bits of embedded SRAM with configurable RAM block organization and programmable FIFO control logic for buffering and streaming data.
- High-Performance Clocks & PLLs Segmentable clock resources and embedded PLLs that accept 14–200 MHz inputs and support frequency synthesis, enabling high-speed internal timing.
- Flexible, High-Speed I/Os 336 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for high-speed differential standards including LVDS capable to 700 Mb/s.
- Performance Metrics Series-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance for demanding signal processing applications.
- Power & Supply Core supply range specified at 1.425 V to 1.575 V for the device core.
- Package, Mounting & Environmental 676-ball Fine BGA (676-FBGA, 27 × 27) surface-mount package; Military grade with operating temperature range from −55 °C to 125 °C. RoHS compliant.
Typical Applications
- Defense & Military Systems Military-grade temperature range and antifuse, nonvolatile programming make this device suitable for rugged defense and deployed systems requiring long-term configuration retention and tamper-resistance.
- High-Speed Data Interfaces Use where many I/Os and high-speed differential links (LVDS up to 700 Mb/s) are required for board-level SERDES, backplane or high-throughput I/O aggregation.
- Real-Time Signal Processing High internal and system clock performance combined with embedded FIFOs suit real-time DSP, packet processing and low-latency communications tasks.
- Secure, High-Integration Designs Antifuse programming with FuseLock and substantial logic density enables secure, compact implementations that reduce BOM and improve system robustness.
Unique Advantages
- Highly Integrated Solution: Combines ~500k equivalent gates, 8,064 logic elements and 336 I/Os to reduce external components and simplify board-level design.
- Nonvolatile, Secure Programming: Antifuse architecture plus FuseLock technology protects IP and prevents unauthorized bitstream extraction or modification.
- Deterministic, High-Speed Operation: Segmentable clocks, embedded PLLs and documented internal/system performance support deterministic timing for real-time systems.
- Flexible I/O Standards: Bank-selectable, mixed-voltage I/Os and support for single-ended and differential standards enable integration with a wide range of interfaces and peripherals.
- Rugged Deployment Capable: Military grade specification and −55 °C to 125 °C operating range make the device appropriate for harsh-environment applications.
- Industry-Compliant Packaging & Assembly: Fine BGA (676-FBGA, 27 × 27) surface-mount package facilitates compact, high-density board designs.
Why Choose AX500-1FG676M?
The AX500-1FG676M positions itself as a secure, high-density FPGA option for designs that require nonvolatile configuration, substantial I/O and embedded memory, and operation across wide temperature extremes. With its AX antifuse architecture, robust on-chip resources and high-speed I/O capabilities, it is particularly well suited to applications that demand deterministic timing and protection of intellectual property.
This device is a practical choice for engineers developing military, communications and high-performance embedded systems who need a single-chip solution that consolidates logic, memory and I/O while providing long-term configuration stability and security.
Request a quote or submit a parts inquiry to evaluate AX500-1FG676M for your next secure, high-performance FPGA design.

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