AX500-1FG676M

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 64 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-1FG676M – Axcelerator FPGA, 336 I/Os, 73,728-bit Embedded RAM, 676-FBGA

The AX500-1FG676M is an Axcelerator family antifuse FPGA offering a single-chip, nonvolatile solution built on Microchip’s AX architecture. This device provides a combination of density (approximately 500,000 equivalent system gates and 8,064 logic elements), a broad I/O set (336 user I/Os), and embedded memory (73,728 bits) for high-performance, security-conscious designs.

Targeted for applications that require deterministic timing, secure programming and high-speed interfaces, the AX500-1FG676M delivers series-level capabilities such as high internal clock performance, embedded PLLs and bank-selectable multi-standard I/Os while supporting military-grade temperature and reliability requirements.

Key Features

  • AX Antifuse Architecture & Nonvolatile Programming Single-chip antifuse technology with FuseLock programming protects against reverse engineering and provides one-time programmable, nonvolatile configuration.
  • Logic Capacity Approximately 500,000 equivalent system gates implemented across 8,064 logic elements, enabling complex digital functions and high integration.
  • Embedded Memory & FIFOs 73,728 bits of embedded SRAM with configurable RAM block organization and programmable FIFO control logic for buffering and streaming data.
  • High-Performance Clocks & PLLs Segmentable clock resources and embedded PLLs that accept 14–200 MHz inputs and support frequency synthesis, enabling high-speed internal timing.
  • Flexible, High-Speed I/Os 336 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for high-speed differential standards including LVDS capable to 700 Mb/s.
  • Performance Metrics Series-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance for demanding signal processing applications.
  • Power & Supply Core supply range specified at 1.425 V to 1.575 V for the device core.
  • Package, Mounting & Environmental 676-ball Fine BGA (676-FBGA, 27 × 27) surface-mount package; Military grade with operating temperature range from −55 °C to 125 °C. RoHS compliant.

Typical Applications

  • Defense & Military Systems Military-grade temperature range and antifuse, nonvolatile programming make this device suitable for rugged defense and deployed systems requiring long-term configuration retention and tamper-resistance.
  • High-Speed Data Interfaces Use where many I/Os and high-speed differential links (LVDS up to 700 Mb/s) are required for board-level SERDES, backplane or high-throughput I/O aggregation.
  • Real-Time Signal Processing High internal and system clock performance combined with embedded FIFOs suit real-time DSP, packet processing and low-latency communications tasks.
  • Secure, High-Integration Designs Antifuse programming with FuseLock and substantial logic density enables secure, compact implementations that reduce BOM and improve system robustness.

Unique Advantages

  • Highly Integrated Solution: Combines ~500k equivalent gates, 8,064 logic elements and 336 I/Os to reduce external components and simplify board-level design.
  • Nonvolatile, Secure Programming: Antifuse architecture plus FuseLock technology protects IP and prevents unauthorized bitstream extraction or modification.
  • Deterministic, High-Speed Operation: Segmentable clocks, embedded PLLs and documented internal/system performance support deterministic timing for real-time systems.
  • Flexible I/O Standards: Bank-selectable, mixed-voltage I/Os and support for single-ended and differential standards enable integration with a wide range of interfaces and peripherals.
  • Rugged Deployment Capable: Military grade specification and −55 °C to 125 °C operating range make the device appropriate for harsh-environment applications.
  • Industry-Compliant Packaging & Assembly: Fine BGA (676-FBGA, 27 × 27) surface-mount package facilitates compact, high-density board designs.

Why Choose AX500-1FG676M?

The AX500-1FG676M positions itself as a secure, high-density FPGA option for designs that require nonvolatile configuration, substantial I/O and embedded memory, and operation across wide temperature extremes. With its AX antifuse architecture, robust on-chip resources and high-speed I/O capabilities, it is particularly well suited to applications that demand deterministic timing and protection of intellectual property.

This device is a practical choice for engineers developing military, communications and high-performance embedded systems who need a single-chip solution that consolidates logic, memory and I/O while providing long-term configuration stability and security.

Request a quote or submit a parts inquiry to evaluate AX500-1FG676M for your next secure, high-performance FPGA design.

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