AX500-1FGG676

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 1,503 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-1FGG676 – Axcelerator FPGA IC, 336 I/Os, 73,728‑bit RAM, 676‑FBGA

The AX500-1FGG676 is an Axcelerator family Field Programmable Gate Array (FPGA) offered by Microchip Technology. Built on the AX architecture and a CMOS antifuse process, this commercial-grade, nonvolatile FPGA targets applications that require high-performance, deterministic timing and dense I/O integration. Typical use cases include high-speed data interfaces, protocol bridging, embedded memory buffering and custom logic acceleration where predictable timing and compact packaging are important.

Key Features

  • Core Capacity — Approximately 500,000 equivalent system gates with 8,064 logic elements, delivering substantial on-chip logic for mid-range FPGA designs.
  • Embedded Memory — Approximately 0.074 Mbits (73,728 bits) of embedded RAM/FIFO resources for on-chip buffering and small-data storage requirements.
  • I/O Integration — 336 user I/Os with support for multi-standard, bank-selectable signaling; suitable for mixed-voltage I/O systems and high‑density board layouts.
  • High-Speed Performance (Series) — Axcelerator family performance characteristics include 350+ MHz system performance and 500+ MHz internal performance, enabling low-latency logic and fast data paths.
  • Programmable Clocking — Segmentable clock resources and embedded PLLs support flexible clock architectures and frequency synthesis (series feature set).
  • Power and Supply — Core supply range 1.425 V to 1.575 V; designed for low-voltage core operation consistent with the Axcelerator family.
  • Package — 676‑ball Fine BGA (676‑FBGA, 27 × 27 mm) surface-mount package optimized for high I/O density and compact board footprint.
  • Operating Range — Commercial grade operation from 0 °C to 70 °C, suitable for a wide range of standard electronics environments.
  • Security & Reliability (Series) — Nonvolatile antifuse programming and FuseLock™ protection as part of the Axcelerator family for design security and protection against reverse engineering.
  • Compliance — RoHS compliant material and manufacturing status.

Typical Applications

  • High-Speed Data Interfaces — Use the device’s high internal performance and dense I/O to implement protocol conversion, SERDES-less parallel interfaces, or LVDS-capable links in mid-range systems.
  • Embedded FIFO and Buffering — Leverage on-chip SRAM/FIFO resources for data buffering, jitter smoothing, and pipeline staging in streaming or packet-based designs.
  • Custom Logic Acceleration — Offload time-critical control and signal-processing tasks from host processors by implementing deterministic hardware logic and tight timing control.
  • Mixed‑Voltage System Glue Logic — Bank-selectable, multi-standard I/Os enable interfacing between 1.5 V, 1.8 V, 2.5 V and 3.3 V domains in complex boards.

Unique Advantages

  • Deterministic Timing: Segmentable clocks and embedded PLLs provide predictable, user-controllable timing for latency‑sensitive designs.
  • Nonvolatile Single‑Chip Solution: Antifuse-based, one-time-programmable architecture eliminates the need for external configuration memory.
  • High I/O Density in a Compact Package: 336 I/Os in a 676‑FBGA footprint reduces board routing complexity while supporting dense connector and peripheral integration.
  • Integrated Memory for Buffers: Built-in SRAM/FIFO memory simplifies designs that require on-chip buffering without adding external RAM devices.
  • Security Features: FuseLock™ programming technology helps protect intellectual property and design integrity.
  • RoHS Compliant: Supports regulatory and environmental requirements for many commercial electronic products.

Why Choose AX500-1FGG676?

The AX500-1FGG676 combines a strong mid-range logic capacity with dense I/O and embedded memory to address applications that require compact, deterministic hardware acceleration and interface consolidation. Its antifuse, single-chip nonvolatile architecture simplifies system boot/configuration and enhances design security.

This part is well suited to designers and procurement teams building commercial-grade products that demand predictable timing, mixed-voltage I/O flexibility, and integrated buffering without relying on external configuration devices. The Axcelerator family support features such as high internal performance, PLL-based clock synthesis and robust I/O options provide long-term design scalability within the family.

Request a quote or submit a product inquiry to receive pricing, availability and ordering information for AX500-1FGG676. Our team can provide additional technical details and support for integration into your design.

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