AX500-FG484M

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

Quantity 1,441 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-FG484M – Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

The AX500-FG484M is an Axcelerator antifuse FPGA from Microchip Technology built on the AX architecture. It delivers a single-chip, nonvolatile FPGA solution with high-performance routing, embedded memory and flexible I/O suitable for designs that demand performance, security and rugged operating conditions.

With 8064 logic elements, approximately 0.074 Mbits of embedded memory and 317 I/Os in a 484-ball BGA package, the device targets applications requiring deterministic timing, in-system diagnostics and a secure, nonvolatile implementation.

Key Features

  • Core & Architecture  Antifuse-based Axcelerator architecture providing a single-chip, nonvolatile FPGA solution with deterministic and user-controllable timing.
  • Logic Capacity  8064 logic elements and 500,000 equivalent gates to implement complex custom logic and control functions.
  • Embedded Memory  73,728 bits of embedded SRAM/FIFO (approximately 0.074 Mbits) with variable-aspect RAM blocks and programmable FIFO control logic.
  • I/O Flexibility  317 user I/Os with bank-selectable mixed-voltage support and programmable output drive/slew; supports a range of single-ended and differential I/O standards per family features.
  • High-Speed Performance  Family-level performance targets include 350+ MHz system performance and 500+ MHz internal performance, plus high-performance embedded FIFO capability.
  • Clocking & PLL  Segmentable clock resources and embedded PLLs with frequency synthesis capabilities up to 1 GHz (family feature).
  • Power & Packaging  Core supply range 1.425 V–1.575 V; supplied in a 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) and intended for surface-mount assembly.
  • Security & Diagnostics  FuseLock™ programming technology to protect against reverse engineering and in-system diagnostic/debug support via Microchip Silicon Explorer II (family feature).
  • Temperature & Grade  Military-grade operation with an operating temperature range of −55 °C to 125 °C and RoHS compliance.

Typical Applications

  • Defense & Aerospace systems  Military-grade temperature range and nonvolatile antifuse reliability suit avionics, secure communications and mission-critical control functions.
  • High-reliability industrial control  Deterministic timing, embedded FIFOs and flexible I/O make the device well suited for industrial automation and real-time control systems.
  • High-speed data interfacing  High internal performance and LVDS-capable I/Os (family feature) support data acquisition, protocol bridging and high-throughput interfaces.
  • Custom ASIC replacement and secure implementations  Nonvolatile single-chip implementation with FuseLock protection enables field-replaceable designs requiring IP protection and reduced BOM complexity.

Unique Advantages

  • Nonvolatile antifuse technology: Eliminates the need for external configuration memory and ensures immediate, secure boot-up behavior.
  • Secure programming with FuseLock™: Protects design IP from reverse engineering and helps safeguard sensitive implementations.
  • High-performance embedded resources: 8064 logic elements and embedded FIFOs provide the throughput and buffering needed for demanding signal-processing paths.
  • Rugged, military-grade operation: −55 °C to 125 °C operating range and a robust package choice support deployment in harsh environments.
  • Flexible I/O and clocking: Bank-selectable I/Os, programmable drive/slew and segmentable clocks with embedded PLLs allow adaptable interface and timing architectures.
  • Compact surface-mount package: 484-ball fine-pitch BGA (23 × 23) offers high I/O density in a compact footprint for space-constrained designs.

Why Choose AX500-FG484M?

The AX500-FG484M combines antifuse nonvolatility, robust security features and high-performance logic and memory in a military-grade FPGA package. It is well suited for engineers designing secure, deterministic systems that require reliable operation across extreme temperatures and a high I/O count.

Backed by the Axcelerator family feature set—embedded PLLs, segmentable clocks, programmable I/Os and in-system diagnostics—this device provides a scalable, secure foundation for long-life, high-reliability designs.

Request a quote or submit an inquiry to obtain pricing and availability for the AX500-FG484M and discuss how it can meet your design requirements.

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