AX500-FGG676

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 628 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-FGG676 – Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

The AX500-FGG676 is an Axcelerator antifuse-based FPGA offering a balance of mid-range logic capacity and high-speed I/O resources. Built on the AX architecture, it provides on-chip SRAM/FIFO, segmentable clocking and PLL resources suited for applications that require deterministic timing and embedded data buffering.

Designed for commercial-grade systems, this device combines 8064 logic elements, 73,728 bits of embedded RAM/FIFO, and 336 user I/Os in a 676-ball BGA package with a 1.425–1.575 V core supply and a 0 °C to 70 °C operating range.

Key Features

  • Logic Capacity — 8064 logic elements and 500,000 equivalent system gates provide mid-range programmable logic for custom control, signal processing and glue-logic implementations.
  • On-chip Memory and FIFOs — 73,728 bits of embedded SRAM with programmable FIFO control logic enable local buffering and efficient data flow management.
  • I/O Resources — 336 user I/Os across bank-selectable I/O banks with multi-standard support, including LVDS and other single-ended/differential standards listed in the family feature set.
  • High-Speed Performance — Family-level performance characteristics include 350+ MHz system performance and internal performance up to 500+ MHz, and LVDS-capable I/Os rated to 700 Mb/s (as specified for the Axcelerator family).
  • Clocking and PLLs — Segmentable clock resources and embedded PLLs support clock management and frequency synthesis across the device.
  • Nonvolatile Antifuse Technology — Single-chip, nonvolatile antifuse programming with FuseLock™ programming protection provides design security and resistance to reverse engineering.
  • Power and Temperature — Core supply range of 1.425 V to 1.575 V (nominal 1.5 V) and commercial operating temperature 0 °C to 70 °C.
  • Package and Mounting — Surface-mount 676-ball BGA (supplier package: 676-FBGA, 27 × 27) for compact board-level integration.
  • Standards and Testability — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic capability through Microchip tools referenced in the family documentation.
  • Environmental — RoHS-compliant.

Typical Applications

  • High-speed data interfaces — LVDS-capable I/Os and bank-selectable standards support implementation of high-speed serial and parallel links requiring deterministic buffering.
  • Embedded buffering and packet handling — On-chip SRAM blocks with embedded FIFO control logic enable localized data flow management for real-time packet buffering and staging.
  • Custom digital controllers — 8064 logic elements and segmented clock resources make the device suitable for implementing custom state machines, control logic and signal preprocessing.
  • Clock generation and timing-sensitive designs — Integrated PLLs and segmentable clocks support designs that require precise frequency synthesis and controlled timing domains.

Unique Advantages

  • Single-chip nonvolatile solution: Antifuse-based programming eliminates the need for external configuration memory and delivers persistent configuration at power-up.
  • Deterministic timing and diagnostics: Segmentable clocks, embedded PLLs and documented in-system diagnostic capabilities enable predictable timing behavior and board-level debugging.
  • Flexible I/O mix: Bank-selectable I/O standards and programmable drive/slew characteristics simplify interfacing with mixed-voltage peripherals and high-speed links.
  • Integrated memory with FIFO control: On-chip SRAM blocks and programmable embedded FIFO logic reduce external memory dependencies for data buffering tasks.
  • Security-oriented programming: FuseLock™ programming technology offers protection against reverse engineering and design theft as described in the family documentation.
  • Compact integration: 676-ball BGA surface-mount package provides a dense footprint for space-constrained board designs.

Why Choose AX500-FGG676?

The AX500-FGG676 positions itself as a mid-range Axcelerator FPGA that pairs substantial programmable logic (8064 logic elements) with embedded memory (73,728 bits) and a generous I/O complement (336 pins). Its antifuse, single-chip architecture and family-level performance attributes make it suitable for commercial systems that require persistent configuration, embedded buffering and controlled timing domains.

This device is well suited to designers who need a compact, RoHS-compliant FPGA solution with deterministic behavior, integrated PLLs and flexible I/O standards. It delivers value through reduced external components, on-chip SRAM/FIFO capability, and security-focused programming technology documented for the Axcelerator family.

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