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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC8306SVMAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19×19) Additional Interfaces: DUART, I2C, SPI, TDM | 359 | ||
 | MPC8306VMADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19×19) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM | 766 | ||
 | MPC8306VMAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 369BGA | Microprocessors | 369-PBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19×19) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM | 1,599 | ||
 | MPC8308CVMADD | NXP Semiconductors | IC MPU MPC83XX 266MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Mounting Type: Surface Mount | 1,393 | ||
 | MPC8308CVMADDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 1,002 | ||
 | MPC8308CVMAFD | NXP Semiconductors | IC MPU MPC83XX 333MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount | 1,719 | ||
 | MPC8308CVMAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 162 | ||
 | MPC8308CVMAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 401 | ||
 | MPC8308CVMAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 549 | ||
 | MPC8308CZQAFD | NXP Semiconductors | IC MPU MPC83XX 333MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount | 1,663 | ||
 | MPC8308CZQAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 1,885 | ||
 | MPC8308CZQAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 1,990 | ||
 | MPC8308VMADD | NXP Semiconductors | IC MPU MPC83XX 266MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Mounting Type: Surface Mount | 15 | ||
 | MPC8308VMADDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 526 | ||
 | MPC8308VMAFDA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 1,056 | ||
 | MPC8308VMAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Mounting Type: Surface Mount | 962 | ||
 | MPC8308VMAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 473MAPBGA | Microprocessors | 473-MAPBGA (19x19) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19×19) Additional Interfaces: DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 718 | ||
 | MPC8309CVMADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 489-LFBGA Supplier Device Package: 489-PBGA (19×19) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM | 1,108 | ||
 | MPC8309CVMAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | 1.8V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount | 104 | ||
 | MPC8309CVMAGDCA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 489BGA | Microprocessors | 489-PBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 489-LFBGA Supplier Device Package: 489-PBGA (19×19) Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM | 648 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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