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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MPC8313ECZQADDC
MPC8313ECZQADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
721
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MPC8313ECZQAFFC
MPC8313ECZQAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
920
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MPC8313ECZQAGDC
MPC8313ECZQAGDCNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
1,250
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MPC8313EVRADDB
MPC8313EVRADDBNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Mounting Type:
Surface Mount
265
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MPC8313EVRADDC
MPC8313EVRADDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
382
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MPC8313EVRAFF
MPC8313EVRAFFNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,061
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MPC8313EVRAFFB
MPC8313EVRAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,370
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MPC8313EVRAFFC
MPC8313EVRAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
638
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MPC8313EVRAGDB
MPC8313EVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
500
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MPC8313EVRAGDC
MPC8313EVRAGDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
917
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N/A
MPC8313EZQADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
324
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MPC8313EZQAFFB
MPC8313EZQAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
969
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MPC8313EZQAFFC
MPC8313EZQAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
168
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QUOTE
MPC8313EZQAGDC
MPC8313EZQAGDCNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
1,803
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QUOTE
MPC8313VRADDB
MPC8313VRADDBNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Mounting Type:
Surface Mount
979
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QUOTE
MPC8313VRADDC
MPC8313VRADDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
149
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MPC8313VRAFF
MPC8313VRAFFNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
298
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MPC8313VRAFFB
MPC8313VRAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
903
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MPC8313VRAFFC
MPC8313VRAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
510
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MPC8313VRAGDC
MPC8313VRAGDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
724
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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