Microprocessors

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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMPC8313ZQADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
54
MPC8313ZQAFFCMPC8313ZQAFFCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR, DDR2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Security; SEC 2.2
Qualification:
Consumer
1,156
MPC8313ZQAGDCMPC8313ZQAGDCNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
924
MPC8314CVRADDAMPC8314CVRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
193
MPC8314CVRAFDAMPC8314CVRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
955
MPC8314CVRAGDAMPC8314CVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
37
MPC8314ECVRADDAMPC8314ECVRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,199
MPC8314ECVRAFDAMPC8314ECVRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
442
MPC8314ECVRAGDAMPC8314ECVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,744
MPC8314EVRADDAMPC8314EVRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
554
MPC8314EVRAFDAMPC8314EVRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
295
MPC8314EVRAGDAMPC8314EVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
205
MPC8314VRADDAMPC8314VRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
877
MPC8314VRAFDAMPC8314VRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,507
MPC8314VRAGDAMPC8314VRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
574
MPC8315CVRADDAMPC8315CVRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
304
MPC8315CVRAFDAMPC8315CVRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
208
MPC8315CVRAGDAMPC8315CVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
545
MPC8315ECVRADDAMPC8315ECVRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
1,747
MPC8315ECVRAFDAMPC8315ECVRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,333

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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