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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC8321EVRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount | 570 | ||
 | MPC8321EVRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,248 | ||
 | MPC8321EZQAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount | 110 | ||
 | MPC8321VRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Mounting Type: Surface Mount | 1,285 | ||
 | MPC8321VRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 941 | ||
 | MPC8321VRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount | 1,000 | ||
 | MPC8321VRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,183 | ||
 | MPC8321ZQADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 452 | ||
 | MPC8321ZQAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Mounting Type: Surface Mount | 1,584 | ||
 | MPC8323CVRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Mounting Type: Surface Mount | 910 | ||
 | MPC8323CVRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,197 | ||
 | MPC8323CVRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 787 | ||
 | MPC8323CVRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 262 | ||
 | MPC8323ECVRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,366 | ||
 | MPC8323ECVRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 232 | ||
 | MPC8323ECVRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 828 | ||
 | MPC8323ECVRAFDCA | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,571 | ||
 | MPC8323EVRADDC | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 695 | ||
 | MPC8323EVRADDCA | NXP Semiconductors | IC MPU MPC83XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,181 | ||
 | MPC8323EVRAFDC | NXP Semiconductors | IC MPU MPC83XX 333MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 205 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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