Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8315ECVRAGDA
MPC8315ECVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM
323
MPC8315EVRADDA
MPC8315EVRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM
342
MPC8315EVRAFDA
MPC8315EVRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM
1,045
MPC8315EVRAGDA
MPC8315EVRAGDANXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 3.3
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM
497
MPC8315VRADDA
MPC8315VRADDANXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM
249
MPC8315VRAFDA
MPC8315VRAFDANXP SemiconductorsIC MPU MPC83XX 333MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM
1,678
MPC8321CVRADDC
MPC8321CVRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
415
MPC8321CVRADDCA
MPC8321CVRADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM, UART
468
MPC8321CVRAFDC
MPC8321CVRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
221
MPC8321CVRAFDCA
MPC8321CVRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM, UART
1,327
MPC8321CZQADDC
MPC8321CZQADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
342
MPC8321CZQAFDC
MPC8321CZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
543
MPC8321ECVRADDC
MPC8321ECVRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
402
MPC8321ECVRADDCA
MPC8321ECVRADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM, UART
159
MPC8321ECVRAFDC
MPC8321ECVRAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
781
MPC8321ECVRAFDCA
MPC8321ECVRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM, UART
1,062
MPC8321ECZQADDC
MPC8321ECZQADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM, UART
933
MPC8321ECZQAFDC
MPC8321ECZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
44
MPC8321EVRADDC
MPC8321EVRADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
475
MPC8321EVRADDCA
MPC8321EVRADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
DUART, I2C, PCI, SPI, TDM, UART
574

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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