Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8275ZQMIBA
MPC8275ZQMIBANXP SemiconductorsIC MPU MPC82XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,365
MPC8280CVVQLDA
MPC8280CVVQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
345
MPC8280CVVUPEA
MPC8280CVVUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
58
MPC8280CZUQLDA
MPC8280CZUQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
47
MPC8280CZUUPEA
MPC8280CZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,048
MPC8280VVQLDA
MPC8280VVQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
201
MPC8280VVUPEA
MPC8280VVUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
490
MPC8280ZUQLDA
MPC8280ZUQLDANXP SemiconductorsIC MPU MPC82XX 333MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
716
MPC8280ZUUPEA
MPC8280ZUUPEANXP SemiconductorsIC MPU MPC82XX 450MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
316
MPC8306CVMABDCA
MPC8306CVMABDCANXP SemiconductorsIC MPU MPC83XX 133MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Mounting Type:
Surface Mount
955
MPC8306CVMACDCA
MPC8306CVMACDCANXP SemiconductorsIC MPU MPC83XX 200MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Mounting Type:
Surface Mount
1,316
MPC8306CVMADDCA
MPC8306CVMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
903
MPC8306CVMAFDCA
MPC8306CVMAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ 369BGAMicroprocessors369-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
369-LFBGA
Supplier Device Package:
369-PBGA (19×19)
Additional Interfaces:
CAN, DUART, I2C, MMC/SD, SPI, TDM
713
MPC8306SCVMABDCA
MPC8306SCVMABDCANXP SemiconductorsIC MPU MPC83XX 133MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Mounting Type:
Surface Mount
1,631
MPC8306SCVMACDCA
MPC8306SCVMACDCANXP SemiconductorsIC MPU MPC83XX 200MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Mounting Type:
Surface Mount
1,973
MPC8306SCVMADDCA
MPC8306SCVMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
46
MPC8306SCVMAFDCA
MPC8306SCVMAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ 369BGAMicroprocessors369-PBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
369-LFBGA
Supplier Device Package:
369-PBGA (19×19)
Additional Interfaces:
DUART, I2C, SPI, TDM
241
MPC8306SVMABDCA
MPC8306SVMABDCANXP SemiconductorsIC MPU MPC83XX 133MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Mounting Type:
Surface Mount
1,149
MPC8306SVMACDCA
MPC8306SVMACDCANXP SemiconductorsIC MPU MPC83XX 200MHZ 369BGAMicroprocessors369-PBGA (19x19)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
369-LFBGA
Supplier Device Package:
369-PBGA (19×19)
Additional Interfaces:
DUART, I2C, SPI, TDM
1,502
MPC8306SVMADDCA
MPC8306SVMADDCANXP SemiconductorsIC MPU MPC83XX 266MHZ 369BGAMicroprocessors369-PBGA (19x19)1.8V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
151

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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