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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC8377ECVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | -40°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Mounting Type: Surface Mount | 1,643 | ||
 | MPC8377ECVRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 1,265 | ||
 | MPC8377ECVRANG | NXP Semiconductors | IC MPU MPC83XX 800MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | -40°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Mounting Type: Surface Mount | 396 | ||
 | MPC8377ECVRANGA | NXP Semiconductors | IC MPU MPC83XX 800MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 360 | ||
 | MPC8377EVRAGD | NXP Semiconductors | IC MPU MPC83XX 400MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Mounting Type: Surface Mount | 753 | ||
 | MPC8377EVRAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 1,027 | ||
 | MPC8377EVRAJF | NXP Semiconductors | IC MPU MPC83XX 533MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Mounting Type: Surface Mount | 755 | ||
 | MPC8377EVRAJFA | NXP Semiconductors | IC MPU MPC83XX 533MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 1,368 | ||
 | MPC8377EVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Mounting Type: Surface Mount | 917 | ||
 | MPC8377EVRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 1,155 | ||
 | MPC8377EVRANG | NXP Semiconductors | IC MPU MPC83XX 800MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Mounting Type: Surface Mount | 1,548 | ||
 | MPC8377VRAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 177 | ||
 | MPC8377VRAJFA | NXP Semiconductors | IC MPU MPC83XX 533MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 1,228 | ||
 | MPC8377VRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Mounting Type: Surface Mount | 1,231 | ||
 | MPC8377VRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 688 | ||
 | MPC8377VRANG | NXP Semiconductors | IC MPU MPC83XX 800MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Mounting Type: Surface Mount | 923 | ||
 | MPC8377VRANGA | NXP Semiconductors | IC MPU MPC83XX 800MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 916 | ||
 | MPC8378CVRAGDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 1,086 | ||
 | MPC8378CVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | -40°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Mounting Type: Surface Mount | 310 | ||
 | MPC8378CVRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI | 881 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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