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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | MPC8379EVRAGDA | NXP Semiconductors | POWERQUICC, 32 BIT POWER ARCH SO | Microprocessors | N/A | N/A | N/A | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Graphics Acceleration: No Co-Processors/DSP: Security; SEC 3.0 SATA: SATA 3Gbps (4) Qualification: Consumer | 1,615 | ||
 | MPC8379EVRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 1,779 | ||
 | MPC8379VRAJFA | NXP Semiconductors | IC MPU MPC83XX 533MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 6 | ||
 | MPC850CVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,518 | ||
 | MPC850CVR66BU | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,515 | ||
 | MPC850CZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 749 | ||
 | MPC850CZQ50BUR2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 303 | ||
 | MPC850DECVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 270 | ||
 | MPC850DECVR66BU | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 262 | ||
 | MPC850DEVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,099 | ||
 | MPC850DEVR66BU | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 698 | ||
 | MPC850DEZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,603 | ||
 | MPC850DSLCVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 742 | ||
 | MPC850DSLCZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 757 | ||
 | MPC850DSLVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,626 | ||
 | MPC850DSLZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 912 | ||
 | MPC850SRVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,585 | ||
 | MPC850SRVR80BU | NXP Semiconductors | IC MPU MPC8XX 80MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 64 | ||
 | MPC850SRZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,290 | ||
 | MPC850VR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 1,137 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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