MPC850DECVR66BU
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 604 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC850 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 66MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 1.x (1) | Voltage – I/O | 3.3V |
Overview of MPC850DECVR66BU – IC MPU MPC8XX 66MHz 256BGA
The MPC850DECVR66BU is a single‑core, 32‑bit microprocessor based on the MPC8xx architecture, running at 66 MHz. It integrates a communications processor module (CPM) and system peripherals to serve embedded communications and networking applications where integration, predictable I/O, and industrial temperature operation matter.
Designed for embedded and telecommunications controller applications, the device combines on‑chip communications channels, a DRAM controller and an 8‑Kbyte dual‑port RAM to simplify system design while supporting a 3.3 V I/O environment and industrial operation from -40 °C to 95 °C.
Key Features
- Core – Embedded single‑issue, 32‑bit MPC8xx core operating at 66 MHz with 32 general‑purpose registers, providing a standard PowerPC‑style execution environment.
- Communications Processor Module (CPM) – Integrated CPM includes a separate RISC communications processor that off‑loads peripheral tasks; the CPM supports up to seven serial channels including SCCs (Ethernet/HDLC), USB, SMCs, I²C and SPI.
- Memory Support – On‑chip DRAM controller plus an 8‑Kbyte dual‑port RAM for high‑efficiency buffer management and shared data handling between host core and CPM.
- Interfaces – Integrated Ethernet (10 Mbps, 1 port), USB 1.x (1 port), HDLC/SDLC and additional serial management channels suitable for communications protocols and serial peripherals.
- Power and I/O – 3.3 V I/O supply for common embedded system compatibility.
- Package and Mounting – 256‑ball PBGA package (23 × 23 mm) for surface mount assembly with compact board area.
- Operating Range and Qualification – Industrial qualification with operating temperature range of -40 °C to 95 °C and RoHS compliance.
- Graphics – No graphics acceleration, focused on communications and control tasks.
Typical Applications
- Telecommunications Access – Implements protocol handling and packet/serial off‑load for remote access and telco interface controllers.
- Embedded Networking Equipment – Acts as a compact communications processor for small routers, gateways and protocol converters that require integrated Ethernet and serial channels.
- Industrial Communications Modules – Performs deterministic I/O and serial protocol handling in industrial control and monitoring systems across wide temperature ranges.
- Peripheral Interface Controllers – Uses on‑chip CPM, USB and serial interfaces to manage multiple peripheral links with reduced host load.
Unique Advantages
- Integrated CPM Off‑load: Reduces host core workload by handling serial protocol tasks independently, simplifying firmware partitioning and improving overall throughput.
- Compact, Surface‑Mount Package: 256‑PBGA (23 × 23 mm) provides high pin density for multiple interfaces while minimizing PCB footprint.
- Industrial Temperature Capability: Rated from -40 °C to 95 °C to suit harsh operating environments and extended‑temperature deployments.
- Broad Interface Set: Built‑in Ethernet, USB 1.x, HDLC/SDLC and serial management channels enable versatile connectivity options without extensive external logic.
- System Memory Features: DRAM controller plus 8‑Kbyte dual‑port RAM support efficient buffering and shared access between core and communications engine.
- Standards‑Friendly I/O Voltage: 3.3 V I/O simplifies integration with common embedded peripherals and transceivers.
Why Choose MPC850DECVR66BU?
The MPC850DECVR66BU positions itself as a capable, integrated microprocessor solution for embedded communications and networking designs that require hardware support for multiple serial channels, Ethernet and USB while operating across industrial temperatures. Its combination of an MPC8xx core, an independent CPM for protocol off‑load, on‑chip memory resources and a compact PBGA package reduces system complexity and BOM count for space‑constrained designs.
This part is suited for developers and procurement teams building remote access, telecommunications and industrial communications equipment who need predictable I/O, peripheral integration and long‑term availability within a RoHS‑compliant, industrially qualified component.
Request a quote or submit an order inquiry to obtain pricing, lead times and available inventory for the MPC850DECVR66BU.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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