MPC850CZQ50BU

The MPC850CZQ50BU is an integrated microprocessor featuring an embedded, single-issue 32-bit MPC8xx core that implements the PowerPC architecture. It is a one-core, 50 MHz microprocessor designed for controller applications, with system integration aimed at communications, networking, remote-access and telecommunications use cases.

Integration includes a Communications Processor Module (CPM) and system-level peripherals that off-load peripheral tasks from the core, enabling compact, cost-sensitive designs with industrial operating temperature support.

Key Features

• Core  Embedded single-issue, 32-bit MPC8xx core (PowerPC architecture); single core operating at 50 MHz.
• Communications Processor Module (CPM)  Includes an independent RISC communications processor (CP) to off-load peripheral and communications tasks from the main core.
• Serial and Peripheral Interfaces  CPM supports up to seven serial channels including SCCs (Ethernet, HDLC/SDLC), one USB channel (USB 1.x), two SMCs, I²C and SPI.
• Network Interfaces  Integrated Ethernet support (10 Mbps, 1 port) and multi-channel HDLC/SDLC functionality.
• Memory and Controllers  On-chip support for DRAM controllers and an 8-Kbyte dual-port RAM is documented for the family.
• Power and I/O  I/O voltage specified at 3.3 V.
• Package and Mounting  256-ball PBGA package (23 × 23 mm), surface mount.
• Qualification and Environment  Industrial qualification with an operating temperature range of −40 °C to 95 °C and RoHS compliance.

Typical Applications

• Communications Equipment  Use in routers, access devices and protocol gateways where integrated Ethernet and HDLC/SDLC support and CPM off-load reduce system complexity.
• Networking Appliances  Embedded networking controllers that require USB 1.x and serial peripheral support alongside an integrated DRAM controller.
• Remote-Access and Telecommunications  Cost-sensitive telecommunication modules benefiting from integrated communications functions and industrial temperature operation.
• Industrial Controllers  Control applications needing a compact, surface-mount 256-PBGA package and extended temperature support.

Unique Advantages

• Highly integrated communications subsystem: The CPM provides a dedicated communications RISC processor and up to seven serial channels, reducing load on the main core and simplifying protocol handling.
• Integrated network and peripheral support: On-chip Ethernet (10 Mbps), USB 1.x and HDLC/SDLC interfaces enable consolidated I/O without extensive external logic.
• Industrial-ready thermal range: Specified operation from −40 °C to 95 °C supports deployment in demanding environments.
• Compact surface-mount package: 256-PBGA (23×23 mm) enables space-efficient board designs for embedded systems.
• 3.3 V I/O and DRAM support: Standard I/O voltage and on-chip DRAM controller support simplify memory and interface design.
• RoHS compliant: Meets environmental compliance requirements for assembly and deployment.

Why Choose MPC850CZQ50BU?

The MPC850CZQ50BU combines a PowerPC-based MPC8xx core with a dedicated Communications Processor Module and integrated peripheral set to deliver a compact, integrated solution for communications and embedded controller designs. Its industrial temperature rating and surface-mount PBGA package make it suitable for deployments that require robustness and density.

Targeted at engineers designing cost-sensitive networking, remote-access and telecommunications equipment, this part reduces system BOM and off-loads protocol processing while providing standard interfaces such as Ethernet and USB for straightforward integration. Backed by NXP Semiconductors manufacturing, it offers continuity within the MPC850 family for designs requiring established communications functionality.

Request a quote or submit an inquiry for pricing and availability to evaluate the MPC850CZQ50BU for your next embedded communications or industrial controller design.