MPC850CVR66BU

The MPC850CVR66BU is a single-core, 32-bit embedded microprocessor based on the MPC8xx core running at 66 MHz. Designed for communications and controller applications, it integrates a Communications Processor Module (CPM) and system peripherals to simplify board-level design for industrial and networking use cases.

This device targets cost-sensitive, remote-access and telecommunications-oriented applications by combining processor performance, on-chip communications resources, and a compact 256-PBGA (23×23) surface-mount package.

Key Features

• Core 32-bit MPC8xx core, single-core operation at 66 MHz for deterministic embedded processing.
• Communications Processor Module (CPM) Integrated CPM provides an independent communications processor to off-load peripheral and protocol tasks from the main core.
• Serial and Protocol Interfaces Supports USB 1.x (1 channel), 10 Mbps Ethernet (1 port), HDLC/SDLC and multiple serial channels via the CPM.
• Memory Support On-chip DRAM controller; family documentation references an 8-Kbyte dual-port RAM in the MPC850 series for inter-processor buffering and shared data.
• Power and I/O 3.3 V I/O signaling for compatibility with common embedded peripherals.
• Package and Mounting 256-PBGA (23×23) package, surface-mount for compact PCB designs.
• Operating Range Industrial-grade operating temperature from −40°C to 95°C to meet harsh-environment deployment requirements.
• Compliance RoHS compliant.

Typical Applications

• Remote Access and Telecommunications Integrated communications features and the CPM make the MPC850CVR66BU suitable for remote access controllers and telecom interface modules.
• Networking Equipment On-chip Ethernet support and multiple serial protocol channels enable use in low-speed network nodes and management interfaces.
• Industrial Control Industrial temperature qualification and compact PBGA packaging allow deployment in factory automation controllers and fielded instrumentation.

Unique Advantages

• Integrated Communications Off-load: The CPM provides an independent communications processor to handle protocol tasks, reducing main-core overhead and simplifying firmware partitioning.
• Compact Surface-Mount Package: 256-PBGA (23×23) package minimizes board area while supporting complex I/O for embedded designs.
• Industrial Temperature Qualification: Rated from −40°C to 95°C for reliable operation in demanding environments.
• Standard 3.3 V I/O: Common I/O voltage simplifies interfacing with a wide range of peripheral devices and level shifters.
• Protocol Flexibility: Built-in support for Ethernet, USB 1.x, HDLC/SDLC and multiple serial channels enables versatile communications configurations without large external controllers.
• RoHS Compliant: Environmentally compliant manufacturing helps meet regulatory and corporate sourcing requirements.

Why Choose MPC850CVR66BU?

The MPC850CVR66BU combines a proven MPC8xx processing core with an integrated Communications Processor Module and a suite of serial and protocol interfaces to deliver a compact, communications-focused embedded MPU. Its industrial temperature rating, 3.3 V I/O, and PBGA package make it well suited for deployed networking, remote-access and industrial controller designs where integration and reliability matter.

Design teams seeking a single-chip solution that reduces external component count and simplifies communications handling will find the MPC850CVR66BU a practical choice. The device’s on-chip peripherals and CPM architecture support robust system partitioning and long-term deployment in industrial environments.

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