MPC850CVR50BU

IC MPU MPC8XX 50MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23)

Quantity 276 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC850
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A991B4BEthernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package256-PBGA (23×23)
USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC850CVR50BU – IC MPU MPC8XX 50MHZ 256BGA

The MPC850CVR50BU is an industrial-grade, single-chip microprocessor from NXP Semiconductors’ MPC850 family. It integrates an embedded MPC8xx 32-bit core running at 50 MHz with on-chip system functions and a Communications Processor Module (CPM), targeting communications, networking, remote-access and telecommunications controller applications.

With integrated interfaces including Ethernet and USB 1.x, a DRAM memory controller, and a CPM that off-loads peripheral tasks to a dedicated RISC communications processor, the MPC850CVR50BU delivers a compact, system-oriented solution for cost-sensitive embedded designs. The device is supplied in a 256‑pin PBGA (23×23) surface-mount package, supports 3.3 V I/O and is qualified for industrial temperature operation from -40 °C to 95 °C.

Key Features

  • Core: Embedded single-issue MPC8xx 32-bit core with standard PowerPC architecture features as used across the MPC850 family.
  • Clock Speed: 50 MHz operating frequency for deterministic embedded control and communications tasks.
  • Power and I/O: 3.3 V I/O levels suitable for common embedded interfaces.
  • Communications Processor Module (CPM): Integrated CPM includes a dedicated RISC communications processor (CP) to off-load peripheral processing and support multiple serial channels.
  • Interfaces: On-chip support for Ethernet (10 Mbps, single channel), USB 1.x, HDLC/SDLC and other serial protocols via SCC/SMC/SPI/I2C channels as provided by the CPM architecture.
  • Memory Support: Integrated DRAM controller for system memory interfacing.
  • Package and Mounting: 256‑PBGA (23×23) surface-mount package for compact board integration.
  • Operating Range & Qualification: Industrial qualification with operating temperature from -40 °C to 95 °C.
  • Environmental Compliance: RoHS compliant.

Typical Applications

  • Communications Equipment: Edge routers, protocol converters and remote-access devices that benefit from integrated Ethernet, HDLC and CPM-based serial off-load.
  • Networking Appliances: Compact network controllers and interfaces requiring an integrated communications processor and DRAM controller.
  • Telecommunications Systems: Cost-sensitive telecom access equipment that needs deterministic control and multiple serial channel support.
  • Industrial Controllers: Embedded control systems operating across a wide temperature range and requiring a surface-mount, compact processor package.

Unique Advantages

  • Integrated Communications Off‑load: The CPM with its dedicated RISC communications processor reduces the main core’s peripheral workload, simplifying firmware partitioning and improving system determinism.
  • Versatile Serial and Network Interfaces: Built-in support for Ethernet, USB 1.x and HDLC/SDLC enables direct connectivity for a range of embedded networking use cases.
  • Industrial Temperature Qualification: Rated for -40 °C to 95 °C, suitable for demanding outdoor and industrial environments.
  • Compact PBGA Package: 256‑pin PBGA (23×23) provides a high-pin-count solution in a compact footprint for dense board layouts.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O simplifies integration with common embedded peripherals and I/O devices.
  • RoHS Compliant: Meets current environmental compliance expectations for electronic assemblies.

Why Choose MPC850CVR50BU?

The MPC850CVR50BU combines an embedded MPC8xx 32‑bit core with dedicated communications hardware and a DRAM controller to provide a tightly integrated platform for communications and networking designs. Its CPM-based architecture and supported serial/network interfaces make it a practical choice for cost-sensitive remote-access, telecom and networking applications that require on-chip peripheral off-load and deterministic control.

Packaged in a 256‑pin PBGA and qualified for industrial temperatures, the MPC850CVR50BU is suited to compact, rugged embedded systems where integrated communications functionality, industrial operating range and standard 3.3 V I/O are required.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC850CVR50BU.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up