MPC850DEVR50BU

IC MPU MPC8XX 50MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23)

Quantity 1,099 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC850
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A991B4BEthernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package256-PBGA (23×23)
USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC850DEVR50BU – IC MPU MPC8XX 50MHZ 256BGA

The MPC850DEVR50BU is a single‑chip microprocessor from NXP Semiconductors based on the embedded MPC8xx core. It integrates a 32‑bit, single‑issue CPU running at 50 MHz with a Communications Processor Module (CPM) and a versatile set of on‑chip peripherals for communications and embedded controller applications.

Built for communications, networking and remote‑access applications, the device delivers a compact, highly integrated solution with USB and Ethernet connectivity, DRAM memory controller support, and surface‑mount 256‑pin PBGA packaging for space‑constrained designs.

Key Features

  • Core — Embedded MPC8xx single‑issue 32‑bit core with a 50 MHz operating frequency and a single processor core.
  • Communications Processor Module (CPM) — On‑chip CPM incorporates a dedicated communications RISC processor (CP) that off‑loads peripheral tasks from the main core; the CPM supports up to seven serial channels and a range of serial controller types.
  • Interfaces — Integrated Ethernet (10 Mbps, 1 port) and USB 1.x (1 channel), plus support for HDLC/SDLC and serial peripheral interfaces documented for the MPC850 family.
  • Memory and Controllers — DRAM memory controller on‑chip and family documentation references an 8‑Kbyte dual‑port RAM for inter‑processor buffering and peripheral transfers.
  • Power and I/O — 3.3 V I/O voltage support for common embedded signaling levels; surface‑mount package for automated assembly.
  • Package and Temperature — 256‑PBGA (23 × 23 mm) package; qualified to consumer temperature range of 0 °C to 95 °C.
  • Environmental — RoHS compliant.

Typical Applications

  • Communications & Networking: Ideal for network controllers and edge devices requiring integrated Ethernet and serial communications off‑load.
  • Remote‑Access Equipment: Suited to modems and remote management modules where a compact, integrated communications processor and USB support simplify design.
  • Telecommunications Equipment: Applicable to cost‑sensitive telecom applications that benefit from the CPM's independent communications processing and serial interface flexibility.
  • Embedded Controller Platforms: Useful in embedded control systems that require a 32‑bit core, DRAM controller support, and multiple serial interfaces in a single package.

Unique Advantages

  • Highly integrated communications functionality: Combines a 32‑bit MPC8xx core with an on‑chip CPM to reduce external components and simplify system design.
  • Dedicated communications off‑load: The CPM’s independent RISC CP handles peripheral and serial channel processing, freeing the main core for application tasks.
  • Broad serial and network interfaces: Native support for Ethernet, USB 1.x, HDLC/SDLC and multiple serial controller types provides flexible connectivity options.
  • Compact surface‑mount package: 256‑pin PBGA (23×23 mm) enables dense PCB layouts while maintaining accessible I/O and controller functionality.
  • Industry documentation and family support: The part is part of the MPC850 PowerQUICC™ family with comprehensive hardware specifications available for system integration.
  • Regulatory & assembly readiness: RoHS compliance and standard 3.3 V I/O simplify manufacturing and environmental compliance considerations.

Why Choose MPC850DEVR50BU?

The MPC850DEVR50BU positions itself as a compact, communications‑focused microprocessor for designers who need an integrated solution combining a 32‑bit MPC8xx core with a Communications Processor Module and a practical set of on‑chip peripherals. Its combination of Ethernet, USB support, DRAM controller and CPM off‑load capabilities makes it well suited for cost‑sensitive networking, remote‑access and telecommunications designs.

Backed by the MPC850 family documentation from NXP Semiconductors, the MPC850DEVR50BU offers clear hardware specifications and peripheral details to support system integration, reduce BOM complexity and accelerate development for embedded communications applications.

Request a quote or submit an order inquiry to obtain pricing, lead time and availability for the MPC850DEVR50BU.

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