MPC850DSLCVR50BU

IC MPU MPC8XX 50MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23)

Quantity 742 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC850
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A991B4BEthernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package256-PBGA (23×23)
USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC850DSLCVR50BU – IC MPU MPC8XX 50MHZ 256BGA

The MPC850DSLCVR50BU is a single‑core, 32‑bit microprocessor based on the MPC8xx family, offered by NXP Semiconductors. It combines an embedded MPC8xx core with integrated communications peripherals and system functions to address communications, networking, remote‑access and telecommunications applications.

Built for integration and embedded deployments, the device features a Communications Processor Module (CPM) that off‑loads peripheral tasks, Ethernet and USB support, an on‑chip memory controller, and industrial qualification for extended temperature operation.

Key Features

  • Core  Single 32‑bit MPC8xx core running at 50 MHz, delivering a predictable embedded processing platform for control and communications tasks.
  • Communications & Peripherals  Integrated CPM and communications-focused co‑processor capabilities; includes support for HDLC/SDLC, one 10 Mbps Ethernet port, and one USB 1.x channel.
  • Memory & Bus  On‑chip DRAM controller and architecture-level support for dual‑port RAM (family datasheet references an 8‑Kbyte dual‑port RAM in the MPC850 family).
  • I/O Voltage  3.3 V I/O signaling, suitable for common embedded interface levels.
  • Package & Mounting  256‑PBGA surface‑mount package (23 × 23 mm) for compact board implementations.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 95 °C.
  • Integration for Protocols  Built‑in support for communications protocols via SCCs and CPM functionality (family documentation highlights multiple serial channels and protocol support).
  • RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

  • Telecommunications Equipment  Use the MPC850 for line cards, remote access units or other telecom modules that require integrated Ethernet, HDLC and protocol handling.
  • Networking Appliances  Suitable for compact networking controllers and embedded routers where an integrated communications processor and USB connectivity are required.
  • Remote‑Access Controllers  Acts as a single‑chip controller for remote‑access and management applications needing industrial temperature operation and communications off‑load.
  • Industrial Embedded Systems  Ideal for industrial control nodes that benefit from a 3.3 V IO domain, surface‑mount PBGA packaging, and industrial qualification.

Unique Advantages

  • Highly integrated communications peripherals: CPM, Ethernet and USB support reduce external components required for networked applications.
  • Off‑load capable architecture: The Communications Processor Module provides a separate RISC communications processor to handle peripheral and protocol tasks, freeing the main MPC8xx core for application logic.
  • Industrial temperature qualification: Rated for −40 °C to 95 °C operation, enabling deployment in harsh and temperature‑sensitive environments.
  • Compact PBGA package: 256‑pin PBGA (23 × 23 mm) supports dense board layouts and surface‑mount assembly.
  • Standard 3.3 V I/O: Compatible with common embedded interface voltages for straightforward system integration.
  • RoHS compliant: Meets environmental compliance requirements for lead‑free manufacturing.

Why Choose MPC850DSLCVR50BU?

The MPC850DSLCVR50BU positions itself as a compact, communications‑centric microprocessor that pairs an MPC8xx embedded core with an integrated Communications Processor Module and peripheral support (Ethernet, USB, HDLC). Its 50 MHz single‑core design, 3.3 V I/O, and industrial temperature rating make it well suited for embedded networking, telecommunications, and remote‑access designs where integration and reliability are priorities.

Backed by NXP Semiconductors and supported by MPC850 family documentation, this device is appropriate for engineers seeking a proven, integrated solution for communications control and protocol handling in industrial and telecom environments.

Request a quote or submit an inquiry to obtain pricing, lead time and available inventory for the MPC850DSLCVR50BU.

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