MPC850SRVR50BU

IC MPU MPC8XX 50MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23)

Quantity 1,585 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC850
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A991B4BEthernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package256-PBGA (23×23)
USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC850SRVR50BU – IC MPU MPC8XX 50MHZ 256BGA

The MPC850SRVR50BU is an integrated microprocessor IC from NXP Semiconductors featuring a single 32-bit MPC8xx core running at 50 MHz. Designed for communications and embedded controller applications, the device combines a PowerPC-based core with a Communications Processor Module (CPM) and integrated system functions to address cost-sensitive remote-access and telecommunications applications.

This device provides on-chip peripheral support including Ethernet, USB 1.x, HDLC/SDLC and DRAM memory control, packaged in a 256‑PBGA (23×23) surface-mount package and specified for operation from 0 °C to 95 °C. The part is RoHS compliant and carries a consumer qualification level.

Key Features

  • Core  Embedded single-issue, 32‑bit MPC8xx core (one core) delivering deterministic control for embedded communications tasks.
  • Performance  50 MHz core clock suitable for cost-sensitive controller applications.
  • Communications Processor Module (CPM)  Integrated CPM includes a separate RISC communications processor to off-load peripheral tasks and supports up to seven serial channels.
  • Serial and Peripheral Interfaces  Single USB 1.x channel, single 10 Mbps Ethernet interface, HDLC/SDLC support, two serial management controllers, SPI and I²C as part of the CPM feature set.
  • Memory and Bus  On-chip support for DRAM controllers and an 8‑Kbyte dual-port RAM (as documented for the MPC850 family) to assist data buffering and inter-processor communication.
  • Package and Mounting  256‑PBGA (23×23) / 256‑BBGA surface-mount package for high-density board designs.
  • Electrical  3.3 V I/O supply level for common embedded system compatibility.
  • Operating Range & Compliance  Rated for operation from 0 °C to 95 °C and RoHS compliant; consumer qualification level.
  • Integration for Networking  Built-in CPM serial controllers and support for Ethernet and USB reduce external component requirements for communication-focused designs.
  • Graphics  No dedicated graphics acceleration; focus is on communications and control functionality.

Typical Applications

  • Remote-access and Telecommunications Equipment  Use the integrated CPM, Ethernet and HDLC/SDLC support to implement remote-access controllers and telecom interfaces in cost-sensitive systems.
  • Embedded Networking Appliances  Single-core MPC8xx performance with on-chip USB and Ethernet makes the part suitable for compact networking or management nodes.
  • Controller and Gateway Devices  DRAM controller support and the CPM’s serial channels allow use as a gateway or protocol converter in embedded networks.

Unique Advantages

  • Integrated Communications Off-load: The CPM’s dedicated communications processor off-loads peripheral and serial protocol handling from the main MPC8xx core, simplifying real-time design.
  • Compact Packaging: 256‑PBGA (23×23) surface-mount package enables a high-density board footprint for space-constrained embedded systems.
  • Well-documented Hardware: The MPC850 family is supported by published hardware specifications and datasheet content that detail power, timing and interfacing characteristics.
  • Common I/O Voltage: 3.3 V I/O simplifies integration with standard embedded components and memory interfaces.
  • Focused Feature Set for Cost-sensitive Designs: A balanced mix of core performance, CPM-based communications and on-chip DRAM support reduces external BOM for networking-centric products.
  • RoHS Compliant: Environmentally compliant construction suitable for current procurement and manufacturing requirements.

Why Choose MPC850SRVR50BU?

The MPC850SRVR50BU positions itself as a compact, communications-focused microprocessor solution combining a 32‑bit MPC8xx core with an integrated CPM and essential peripheral interfaces (Ethernet, USB 1.x, HDLC/SDLC). Its 50 MHz operating point and on-chip DRAM support make it suitable for embedded networking controllers and remote-access devices where integration and predictable peripheral handling are priorities.

Backed by NXP Semiconductors documentation for the MPC850 family, this device suits designers seeking a documented, integrated platform for cost-effective communications and embedded control applications, offering straightforward integration with 3.3 V systems and standard surface-mount assembly.

Request a quote or submit a quote inquiry to evaluate the MPC850SRVR50BU for your next embedded communications or controller design.

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