MPC850SRVR50BU
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 1,585 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC850 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 50MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 1.x (1) | Voltage – I/O | 3.3V |
Overview of MPC850SRVR50BU – IC MPU MPC8XX 50MHZ 256BGA
The MPC850SRVR50BU is an integrated microprocessor IC from NXP Semiconductors featuring a single 32-bit MPC8xx core running at 50 MHz. Designed for communications and embedded controller applications, the device combines a PowerPC-based core with a Communications Processor Module (CPM) and integrated system functions to address cost-sensitive remote-access and telecommunications applications.
This device provides on-chip peripheral support including Ethernet, USB 1.x, HDLC/SDLC and DRAM memory control, packaged in a 256‑PBGA (23×23) surface-mount package and specified for operation from 0 °C to 95 °C. The part is RoHS compliant and carries a consumer qualification level.
Key Features
- Core Embedded single-issue, 32‑bit MPC8xx core (one core) delivering deterministic control for embedded communications tasks.
- Performance 50 MHz core clock suitable for cost-sensitive controller applications.
- Communications Processor Module (CPM) Integrated CPM includes a separate RISC communications processor to off-load peripheral tasks and supports up to seven serial channels.
- Serial and Peripheral Interfaces Single USB 1.x channel, single 10 Mbps Ethernet interface, HDLC/SDLC support, two serial management controllers, SPI and I²C as part of the CPM feature set.
- Memory and Bus On-chip support for DRAM controllers and an 8‑Kbyte dual-port RAM (as documented for the MPC850 family) to assist data buffering and inter-processor communication.
- Package and Mounting 256‑PBGA (23×23) / 256‑BBGA surface-mount package for high-density board designs.
- Electrical 3.3 V I/O supply level for common embedded system compatibility.
- Operating Range & Compliance Rated for operation from 0 °C to 95 °C and RoHS compliant; consumer qualification level.
- Integration for Networking Built-in CPM serial controllers and support for Ethernet and USB reduce external component requirements for communication-focused designs.
- Graphics No dedicated graphics acceleration; focus is on communications and control functionality.
Typical Applications
- Remote-access and Telecommunications Equipment Use the integrated CPM, Ethernet and HDLC/SDLC support to implement remote-access controllers and telecom interfaces in cost-sensitive systems.
- Embedded Networking Appliances Single-core MPC8xx performance with on-chip USB and Ethernet makes the part suitable for compact networking or management nodes.
- Controller and Gateway Devices DRAM controller support and the CPM’s serial channels allow use as a gateway or protocol converter in embedded networks.
Unique Advantages
- Integrated Communications Off-load: The CPM’s dedicated communications processor off-loads peripheral and serial protocol handling from the main MPC8xx core, simplifying real-time design.
- Compact Packaging: 256‑PBGA (23×23) surface-mount package enables a high-density board footprint for space-constrained embedded systems.
- Well-documented Hardware: The MPC850 family is supported by published hardware specifications and datasheet content that detail power, timing and interfacing characteristics.
- Common I/O Voltage: 3.3 V I/O simplifies integration with standard embedded components and memory interfaces.
- Focused Feature Set for Cost-sensitive Designs: A balanced mix of core performance, CPM-based communications and on-chip DRAM support reduces external BOM for networking-centric products.
- RoHS Compliant: Environmentally compliant construction suitable for current procurement and manufacturing requirements.
Why Choose MPC850SRVR50BU?
The MPC850SRVR50BU positions itself as a compact, communications-focused microprocessor solution combining a 32‑bit MPC8xx core with an integrated CPM and essential peripheral interfaces (Ethernet, USB 1.x, HDLC/SDLC). Its 50 MHz operating point and on-chip DRAM support make it suitable for embedded networking controllers and remote-access devices where integration and predictable peripheral handling are priorities.
Backed by NXP Semiconductors documentation for the MPC850 family, this device suits designers seeking a documented, integrated platform for cost-effective communications and embedded control applications, offering straightforward integration with 3.3 V systems and standard surface-mount assembly.
Request a quote or submit a quote inquiry to evaluate the MPC850SRVR50BU for your next embedded communications or controller design.

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