MPC850VR50BU

IC MPU MPC8XX 50MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23)

Quantity 1,137 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC850
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A991B4BEthernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package256-PBGA (23×23)
USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC850VR50BU – IC MPU MPC8XX 50MHZ 256BGA

The MPC850VR50BU is a single‑core, 32‑bit microprocessor in the MPC850 family from NXP Semiconductors, running at 50 MHz and targeted at embedded communications and networking applications. It combines an MPC8xx core with an integrated Communications Processor Module (CPM), DRAM memory controller features and peripheral interfaces to simplify system design for cost‑sensitive remote‑access and telecommunications products.

Key Features

  • Core and Performance — Embedded single‑issue 32‑bit MPC8xx core operating at 50 MHz, suitable for single‑core embedded control tasks.
  • Communications Processor Module (CPM) — Integrated CPM provides an independent communications processor to off‑load peripheral and protocol handling from the main core, improving system task separation and throughput.
  • Peripheral Interfaces — On‑chip support for USB 1.x (1 channel), Ethernet (10 Mbps, 1 port) and HDLC/SDLC serial protocols for common embedded communications needs.
  • Serial Channel Support — CPM supports multiple serial channels including SCCs, SMCs, I2C and SPI, enabling flexible peripheral connectivity and protocol implementations.
  • Memory and Controllers — Integrated DRAM controller and a larger on‑chip dual‑port RAM (8 Kbytes in the MPC850 family) to assist with buffer management and shared memory tasks.
  • Power and I/O — 3.3 V I/O voltage compatibility for common embedded system interfaces.
  • Package and Mounting — 256‑ball PBGA (23 × 23 mm) surface‑mount package (256‑BBGA footprint) for compact board integration.
  • Operating Range — Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C.
  • Standards and Compliance — RoHS compliant, supporting environmental and sourcing requirements.

Typical Applications

  • Communications & Networking — Protocol handling and packet interfacing in cost‑sensitive network nodes and remote access equipment, leveraging the integrated CPM and Ethernet support.
  • Telecommunications Equipment — Control and peripheral management in telecom devices where USB and serial protocol off‑load reduce software overhead on the main core.
  • Embedded Control Systems — Single‑core embedded applications requiring a compact BGA package and integrated DRAM controller for system memory tasks.

Unique Advantages

  • Integrated Communications Off‑load — The CPM provides a dedicated communications processor, reducing application CPU load and simplifying protocol implementation.
  • Compact, Surface‑Mount Package — 256‑PBGA (23 × 23) package enables dense board layouts while maintaining robust I/O connections.
  • Flexible Peripheral Set — Built‑in USB 1.x, Ethernet and multiple serial interfaces enable a wide range of connectivity options without additional controllers.
  • Designed for Cost‑Sensitive Designs — Consumer qualification and integrated features help reduce BOM complexity for remote‑access and networking products.
  • Environmentally Compliant — RoHS compliance supports regulatory and sustainability requirements in product development.

Why Choose MPC850VR50BU?

The MPC850VR50BU positions itself as a compact, integrated microprocessor solution for embedded communications and control designs. With an MPC8xx core, an on‑chip CPM, USB and Ethernet support, plus DRAM controller capability in a 256‑PBGA package, it suits systems that require protocol off‑load and streamlined peripheral integration.

This device is a practical choice for developers building cost‑sensitive networked and telecommunications equipment that need reliable, RoHS‑compliant components with consumer‑grade temperature range and 3.3 V I/O compatibility.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC850VR50BU for your next embedded communications or networking project.

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