MPC852TCVR100A
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 1,740 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC852 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 100MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| Voltage – I/O | 3.3V |
Overview of MPC852TCVR100A – IC MPU MPC8XX 100MHZ 256BGA
The MPC852TCVR100A is a single‑core 32‑bit microprocessor built on the MPC8xx core and Power Architecture technology, rated for operation at 100 MHz. It integrates a communications processor module (CPM) and system integration features targeted at embedded Ethernet and communications applications.
Designed for industrial environments, the device provides 3.3 V I/O with 5 V TTL compatibility, a 1.8 V core, a 256‑pin PBGA (23 × 23) surface‑mount package, and an operating temperature range of −40 °C to 100 °C.
Key Features
- Core & Architecture MPC8xx 32‑bit core running up to 100 MHz; includes MMUs and instruction/data caches as part of the PowerPC‑based architecture.
- Communications & CPM Integrated communications processor module (CPM) and communications DSP support for embedded protocol handling and offloaded data processing.
- Memory & Bus DRAM controller and support for an external bus with maximum external bus frequency referenced at 66 MHz in the hardware documentation.
- I/O Voltage & Compatibility 3.3 V I/O operation with 5 V TTL compatibility; 1.8 V core supply as specified in the hardware documentation.
- Interfaces On‑chip 10 Mbps Ethernet (1 port) and additional serial link protocols including HDLC/SDLC; IEEE 1149.1 electrical specifications are included in the device documentation.
- Package & Mounting 256‑PBGA (23 × 23) surface‑mount package optimized for compact embedded board designs.
- Industrial Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 100 °C for demanding environments.
- Documentation Detailed PowerQUICC™ family and MPC852T hardware specifications are provided in the device datasheet and technical documentation.
Typical Applications
- Ethernet Control Equipment — Embedded controllers for Ethernet management and device control leveraging the integrated CPM and Ethernet interface.
- CPE and Access Devices — Customer premise equipment where compact packaging, industrial temperature support, and integrated communications simplify system design.
- Routers and Hubs — Networking appliances that benefit from on‑chip protocol handling and a dedicated communications processor.
- VoIP Clients and Gateways — Voice over IP endpoints that use the communications subsystem for media and signaling processing.
- WiFi Access Points — Control and management functions for wireless access infrastructure leveraging the PowerQUICC heritage.
Unique Advantages
- Highly integrated communications subsystem: The built‑in CPM and communications DSP capabilities reduce external peripheral requirements for protocol handling.
- PowerPC‑based processing: MPC8xx core with MMUs and caches provides a familiar architecture for embedded development and system software portability.
- Industrial‑grade thermal range: −40 °C to 100 °C operation supports deployment in harsh and temperature‑sensitive environments.
- Flexible I/O voltage compatibility: 3.3 V I/O with 5 V TTL compatibility simplifies interfacing to legacy and mixed‑voltage peripherals.
- Compact surface‑mount PBGA: 256‑pin PBGA (23 × 23) package enables high‑density board designs while maintaining a broad peripheral set.
- Comprehensive hardware documentation: PowerQUICC family and MPC852T hardware specifications provide detailed guidance for power, timing, and layout practices.
Why Choose MPC852TCVR100A?
The MPC852TCVR100A combines a PowerPC‑based MPC8xx core with a dedicated communications processor module, making it a fit-for-purpose solution for embedded networking and communications products. Its integrated peripherals, DRAM controller, and protocol interfaces simplify board‑level design while the 256‑pin PBGA package keeps the footprint compact.
With industrial qualification, broad temperature range, and vendor hardware documentation from the PowerQUICC family, this device suits designers building stable, long‑lived embedded network appliances and industrial communications equipment that require deterministic communications handling and proven documentation support.
Request a quote or submit a purchasing inquiry to receive pricing and availability details for the MPC852TCVR100A and to begin the procurement process.

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