MPC852TCZT100A
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 280 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC852 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 100MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| Voltage – I/O | 3.3V |
Overview of MPC852TCZT100A – IC MPU MPC8XX 100MHZ 256BGA
The MPC852TCZT100A is a single‑core, 32‑bit microprocessor in the MPC852 family, featuring an MPC8xx PowerPC‑based core operating at 100 MHz. Designed as an integrated communications controller, it combines processor, system integration and communications modules to address networked embedded applications.
Targeted at industrial and communications markets, this device provides integrated communications peripherals (including a Communications Processor Module), DRAM controller support, a 10 Mbps Ethernet interface, and industry‑grade operating range and packaging for reliable deployment in embedded designs.
Key Features
- Core and Architecture MPC8xx PowerPC‑based 32‑bit core running at 100 MHz; includes MMU and cache architecture typical of the MPC8xx family.
- Performance & External Bus 100 MHz core with external bus support up to 66 MHz, enabling balanced host and peripheral data throughput.
- Communications Processing (CPM) Integrated Communications Processor Module for HDLC/SDLC and communications offload; DSP/communications co‑processor functionality is provided.
- Ethernet Built‑in 10 Mbps Ethernet interface (1) suitable for Ethernet control and networked peripheral tasks.
- Memory Interfaces On‑chip DRAM controller support to interface system memory for embedded applications.
- Voltage & I/O 3.3 V I/O operation with a 1.8 V core voltage; 5 V TTL compatibility for selected signals as defined in the hardware specifications.
- Package & Mounting 256‑pin PBGA (23 × 23 mm) surface‑mount package for high‑density board designs.
- Industrial Qualification & Temperature Industrial‑qualified device with operating temperature range from −40 °C to 100 °C and RoHS compliance.
Typical Applications
- Ethernet Control Equipment Use in Ethernet control applications where integrated communications processing and a 10 Mbps interface simplify networked device design.
- Customer Premises Equipment (CPE) Suitable for CPE devices that require an embedded PowerPC core, DRAM interfacing, and dedicated communications peripherals.
- Routers and Hubs Offers integrated communications functionality and external bus support for designs such as routers, hubs and other network infrastructure equipment.
- VoIP Clients and Networked Access Points Appropriate for VoIP clients and wireless access point controller functions that leverage the CPM and HDLC/SDLC interfaces.
Unique Advantages
- Integrated Communications Controller: Combines MPC8xx core, SIU and CPM on a single chip to reduce system BOM and simplify board-level integration.
- Dedicated Communications Interfaces: HDLC/SDLC support and a CPM offload engine enable efficient handling of protocol and serial communications workloads.
- Industrial‑Grade Operation: −40 °C to 100 °C operating range and industrial qualification make it suitable for demanding embedded environments.
- Compact, High‑Density Packaging: 256‑pin PBGA (23 × 23 mm) surface‑mount package supports compact board layouts without sacrificing I/O.
- Balanced I/O and Core Voltages: 3.3 V I/O with a 1.8 V core and 5 V TTL compatibility provide flexible interfacing options for mixed‑voltage systems.
Why Choose MPC852TCZT100A?
The MPC852TCZT100A positions itself for embedded communications designs that require a PowerPC‑based processor combined with integrated communications peripherals and robust industrial operation. With a 100 MHz MPC8xx core, on‑chip CPM, DRAM controller, and a 10 Mbps Ethernet interface, it targets designs where integration, deterministic communications handling, and industrial temperature performance are essential.
This part is well suited to engineers building networked embedded products—such as routers, CPE, VoIP clients and Ethernet control devices—who need a compact, surface‑mount package and industry‑rated temperature support while leveraging the MPC8xx/PowerQUICC heritage for predictable integration into communication‑centric systems.
Request a quote or submit an inquiry to receive pricing and availability for the MPC852TCZT100A and accelerate your embedded communications design cycle.

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