MPC852TVR100

IC MPU MPC8XX 100MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 256-PBGA (23x23)

Quantity 1,486 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC852
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN3A001A3Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed100MHzSupplier Device Package256-PBGA (23×23)
Voltage – I/O3.3V

Overview of MPC852TVR100 – IC MPU MPC8XX 100MHZ 256BGA

The MPC852TVR100 is an NXP Semiconductors embedded microprocessor based on the MPC8xx PowerPC architecture, delivering a 32-bit single-core CPU at 100 MHz. It combines an integrated communications controller and a Communication Processor Module (CPM) to target embedded network and control applications in the consumer market.

Designed for applications that require integrated communications, 3.3 V I/O with 5 V TTL compatibility and compact surface-mount packaging, the MPC852TVR100 offers balanced performance, peripheral integration, and documentation support from the manufacturer.

Key Features

  • Core & Performance  MPC8xx single-issue 32-bit core running at 100 MHz; the device supports external bus operation to 66 MHz as documented in the hardware specification.
  • Power & I/O Levels  1.8 V core operation with 3.3 V I/O and 5 V TTL compatibility for common mixed-voltage system interfaces.
  • Communications & Co-Processing  Integrated Communication Processor Module (CPM) for communications handling and DSP-style communications co-processing.
  • Networking Interfaces  On-chip Ethernet support (10 Mbps, single port) and serial link protocols including HDLC/SDLC for protocol framing and link-level control.
  • Memory & Bus  Integrated DRAM controller and internal memory management units with instruction and data caches to support embedded system memory architectures.
  • Package & Mounting  256-PBGA (23×23) surface-mount package (256-BBGA case) for compact board-level integration.
  • Operating Range & Compliance  Consumer-qualified device rated for 0 °C to 95 °C operating temperature and RoHS compliant.

Typical Applications

  • Ethernet CPE and Access Devices  Use the integrated Ethernet and CPM to handle packet framing and link control in customer-premises equipment and access-point designs.
  • Routers and Network Appliances  Offload communications tasks to the CPM while the MPC8xx core manages control and system functions in compact router platforms.
  • VoIP and Media Clients  Support VoIP client control and basic network protocol handling using the integrated communications subsystem and HDLC/SDLC interfaces.
  • Embedded Control Systems  Ideal for embedded controller roles that require a single 32-bit core with integrated DRAM controller and mixed-voltage I/O compatibility.

Unique Advantages

  • Integrated Communications Subsystem: On-chip CPM and communications co-processing simplify design for protocol-heavy embedded network systems and reduce external component count.
  • Mixed-Voltage Interface Compatibility: 3.3 V I/O with 5 V TTL compatibility enables straightforward interfacing to a wide range of legacy peripherals and board-level signals.
  • Compact Surface-Mount Package: 256-PBGA (23×23) packaging supports high-density board layouts for space-constrained embedded designs.
  • Documented Hardware Characteristics: Detailed hardware specifications and electrical characteristics are available from the manufacturer to support power sequencing, layout, and thermal design.
  • RoHS Compliant: Conforms to RoHS requirements for environmental compliance in consumer and commercial products.
  • Consumer Market Qualification: Rated for consumer applications with an operating range of 0 °C to 95 °C for typical embedded and network equipment environments.

Why Choose MPC852TVR100?

The MPC852TVR100 positions itself as a compact, communications-focused embedded MPU that pairs a 32-bit MPC8xx PowerPC core at 100 MHz with an integrated CPM and peripheral set tailored for networked consumer devices. Its mixed-voltage I/O, DRAM controller, and documented electrical/thermal characteristics make it suitable for designers seeking a well-documented, integrated solution for Ethernet control and embedded networking applications.

Backed by NXP Semiconductors documentation, the MPC852TVR100 supports development where predictable interfacing, compact packaging, and communications integration reduce BOM complexity and accelerate time to market.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the MPC852TVR100 and to discuss your design requirements.

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