MPC852TCZT66A

The MPC852TCZT66A is a single‑core, 32‑bit microprocessor IC based on the MPC8xx core and Power Architecture™ technology. It combines a PowerPC™ processor core with integrated system and communications modules to address embedded networking and control applications.

Targeted uses include Ethernet control and communications equipment where integration, industrial temperature operation, and standard 3.3 V I/O are required. The device delivers system-level integration through an on‑chip Communications Processor Module (CPM) and DRAM controller, simplifying board design.

Key Features

• Core 
  Single MPC8xx 32‑bit processor core with operation tied to a 66 MHz external bus (device offered at 66 MHz).
• Power and I/O 
  1.8 V core operation with 3.3 V I/O and 5 V TTL compatibility, supporting common embedded voltage domains.
• Communications and Co‑processing 
  Integrated Communications Processor Module (CPM) with communications co‑processor functionality and support for HDLC/SDLC interfaces.
• Memory Support 
  On‑chip DRAM controller to manage external memory interfaces for embedded system memory needs.
• Ethernet 
  Includes Ethernet capability listed as 10 Mbps (1) to support networked applications.
• Package and Mounting 
  256‑PBGA (23 × 23 mm) package, surface‑mount for high‑density board integration.
• Industrial Qualification 
  Rated for industrial use with an operating temperature range of −40 °C to 100 °C.
• Standards and Compliance 
  RoHS‑compliant for environmental regulation adherence in assembly.

Typical Applications

• Ethernet control equipment 
  Ideal for embedded controllers and appliances that require on‑chip communications processing and Ethernet connectivity.
• Customer Premises Equipment (CPE) 
  Suitable for routers, hubs and other CPE devices that benefit from integrated CPM and DRAM controller functions.
• VoIP and networked clients 
  Supports embedded VoIP clients and similar networked endpoints that need communications offload and HDLC/SDLC interfaces.
• Wireless access points 
  Can be used in WiFi access point designs where a compact, surface‑mount processor with integrated communications is preferred.

Unique Advantages

• Highly integrated communications 
  On‑chip Communications Processor Module (CPM) and HDLC/SDLC support reduce external peripheral requirements and simplify BOM.
• Industrial temperature range 
  Rated from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Standard I/O voltage compatibility 
  3.3 V I/O with 5 V TTL compatibility eases interfacing with legacy and modern peripherals.
• Compact surface‑mount package 
  256‑PBGA (23 × 23) enables high‑density board layouts for space‑constrained designs.
• Regulatory readiness 
  RoHS compliance supports environmental and assembly requirements for modern production.

Why Choose MPC852TCZT66A?

The MPC852TCZT66A brings a balanced combination of processor performance, integrated communications, and industrial robustness for embedded networking and control designs. Its MPC8xx core, CPM integration, and on‑chip DRAM controller reduce system complexity while supporting common embedded I/O voltages and industrial temperature operation.

This device is well suited for engineers developing Ethernet‑centric controllers, CPE, VoIP clients, and wireless access points who require a compact, surface‑mount processor solution with communications offload capabilities and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the MPC852TCZT66A and to discuss volume requirements or lead‑time options.