MPC850SRZQ50BU

The MPC850SRZQ50BU is an integrated microprocessor from NXP Semiconductors’ MPC850 family, featuring a single embedded MPC8xx core at 50 MHz. Designed for communications and controller applications, it combines a 32-bit PowerPC-based core with a Communications Processor Module (CPM) and a versatile memory interface to support cost-sensitive networking and remote-access designs.

This surface-mount device is supplied in a 256‑pin PBGA (23×23) package, with 3.3 V I/O and an operating temperature range of 0 °C to 95 °C, making it suitable for consumer-facing embedded systems requiring integrated connectivity and peripheral off-load capabilities.

Key Features

• Core  Single embedded MPC8xx 32-bit core running at 50 MHz; implements the PowerPC architecture for standard embedded instruction support.
• Communications Processor Module (CPM)  Integrated CPM that off-loads peripheral tasks from the main core; supports multiple serial channels and specialized communications handling.
• Serial and Network Interfaces  Includes USB 1.x support (1 channel), a 10 Mbps Ethernet interface (1), and additional HDLC/SDLC protocol support for serial communications.
• Peripheral Interfaces  CPM supports serial communications controllers (SCCs), serial management controllers (SMCs), I2C and SPI interfaces as described in the MPC850 family documentation.
• Memory and Bus  Integrated DRAM controller to simplify external memory interfacing and system design.
• Package and Mounting  256‑PBGA (23×23) package, surface-mount mounting type for compact board-level integration.
• Electrical and Environmental  3.3 V I/O voltage and RoHS-compliant construction; consumer qualification and operating temperature range of 0 °C to 95 °C.

Typical Applications

• Communications Equipment  Embedded controllers in fixed-line or remote-access network devices where an integrated communications processor and Ethernet/HDLC support are required.
• Telecommunications Systems  Control and protocol off-load in cost-sensitive telecom applications that benefit from the CPM’s serial channel support.
• Embedded Networking Appliances  Consumer and small-office networking appliances that need USB 1.x, Ethernet connectivity, and DRAM interfacing in a compact PBGA package.
• Protocol-Concentrated Controllers  Devices that require dedicated handling of serial protocols (HDLC/SDLC) and multiple serial interfaces via the CPM.

Unique Advantages

• Integrated Communications Off-load: The onboard CPM reduces load on the main MPC8xx core by handling serial channels and protocol tasks, simplifying firmware partitioning and improving system responsiveness.
• Compact Surface-Mount Package: 256‑PBGA (23×23) packaging enables high-density board layouts while providing the connectivity and memory interfaces needed for embedded networking products.
• Broad Peripheral Support: Native support for Ethernet, USB 1.x, HDLC/SDLC and multiple serial interfaces lowers BOM count and accelerates system integration.
• Standard Voltage and Compliance: 3.3 V I/O and RoHS compliance make the part suitable for mainstream consumer embedded designs with common power rails and environmental regulations.
• Designed for Controller and Networking Use: The combination of a 32-bit PowerPC-based core and dedicated communications hardware targets designs where protocol handling and controller tasks must coexist on a single chip.

Why Choose MPC850SRZQ50BU?

The MPC850SRZQ50BU positions itself as a practical, integrated solution for consumer embedded systems that require a PowerPC-based 32-bit core alongside robust communications handling. Its CPM-centric architecture and peripheral set make it appropriate for communications, networking and remote-access controller designs where off-loading protocol work and minimizing external components are priorities.

With a 256‑pin PBGA footprint, 3.3 V I/O, and an operating range up to 95 °C, this part delivers a compact, RoHS-compliant platform backed by the MPC850 family documentation for system integration and power/thermal planning.

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