MPC850DSLZQ50BU

IC MPU MPC8XX 50MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23)

Quantity 912 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC850
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A991B4BEthernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed50MHzSupplier Device Package256-PBGA (23×23)
USBUSB 1.x (1)Voltage – I/O3.3V

Overview of MPC850DSLZQ50BU – IC MPU MPC8XX 50MHZ 256BGA

The MPC850DSLZQ50BU is a single‑core, 32‑bit microprocessor IC based on the MPC8xx core, running at 50 MHz. It integrates a communications processor module (CPM), memory controller support and peripheral interfaces to address embedded and networking controller applications.

Built for communications‑focused and cost‑sensitive designs, the device is positioned for remote‑access, telecommunications and networked embedded products where integrated serial, USB and Ethernet connectivity are required alongside a compact PBGA package.

Key Features

  • Core  Embedded MPC8xx single‑issue 32‑bit core running at 50 MHz, with architecture and register structure consistent with the MPC8xx family.
  • Communications Processor Module (CPM)  On‑chip CPM provides a dedicated RISC communications processor to off‑load peripheral tasks; CPM supports multiple serial channels and protocols as described in the MPC850 family documentation.
  • Integrated Serial and Network Interfaces  Includes USB 1.x (1), 10 Mbps Ethernet (1), and additional interfaces such as HDLC/SDLC; CPM channel support includes SCCs, USB, SMCs, I2C and SPI per family documentation.
  • Memory and DRAM Support  Memory controller support for DRAM and a larger dual‑port RAM on the MPC850 family (series documentation specifies an 8‑Kbyte dual‑port RAM implementation).
  • Power and I/O  3.3 V I/O voltage specification suitable for common embedded system levels.
  • Package and Mounting  256‑PBGA package (256‑BBGA / 23×23) designed for surface‑mount assembly to support compact board layouts.
  • Operating Temperature  Rated for operation from 0°C to 95°C, matching consumer qualification requirements.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Telecommunications & Networking Equipment  Use as an integrated communications processor for packet handling, protocol off‑load and network interface tasks in telecom or network devices.
  • Remote‑Access and Gateway Devices  Ideal for remote‑access controllers and gateway modules where USB, serial protocols and Ethernet connectivity are required.
  • Cost‑Sensitive Embedded Controllers  Suited to embedded controller designs that benefit from an integrated communications engine and compact PBGA footprint.
  • Protocol‑Driven Interfaces  Appropriate for devices implementing HDLC/SDLC, I2C, SPI or other serial management channels supported by the CPM.

Unique Advantages

  • Integrated Communications Engine: The CPM provides a dedicated processor to handle peripheral and serial tasks, reducing load on the main MPC8xx core.
  • Multi‑protocol Interface Set: On‑chip support for USB 1.x, Ethernet, HDLC/SDLC and multiple serial channels simplifies BOM and interface routing.
  • Compact PBGA Package: 256‑PBGA (23×23) surface‑mount package enables high‑density board designs for space‑constrained applications.
  • Standard 3.3 V I/O: Compatibility with common 3.3 V embedded logic levels eases integration with typical peripheral ecosystems.
  • Documented Family Ecosystem: Part of the MPC850 PowerQUICC family with published hardware specifications and electrical/thermal characteristics to support system design.
  • RoHS Compliant and Consumer Qualification: Meets RoHS requirements and is qualified for consumer temperature and usage profiles.

Why Choose MPC850DSLZQ50BU?

The MPC850DSLZQ50BU combines a 32‑bit MPC8xx core with a dedicated communications processor module and an integrated set of serial and network interfaces, offering a compact, documented solution for embedded communications and controller designs. Its 3.3 V I/O, DRAM controller support and PBGA footprint make it suitable for space‑conscious, cost‑sensitive products that require protocol handling and peripheral off‑load.

This part is ideal for engineers designing telecommunications, remote‑access or networked embedded systems who need a balance of integration, interface flexibility and supplier documentation from the MPC850 family.

Request a quote or submit an inquiry for pricing and availability of the MPC850DSLZQ50BU to assess suitability for your next embedded communications design.

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