MPC850DSLCZQ50BU
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 757 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC850 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 1.x (1) | Voltage – I/O | 3.3V |
Overview of MPC850DSLCZQ50BU – IC MPU MPC8XX 50MHZ 256BGA
The MPC850DSLCZQ50BU is a single‑core, 32‑bit microprocessor based on the MPC8xx core architecture, operating at 50 MHz and designed for embedded communications and networking applications. It integrates a Communications Processor Module (CPM) and system peripherals to simplify controller designs for cost‑sensitive remote‑access, telecommunications and industrial networking equipment.
Built for industrial environments, the device supports a 3.3 V I/O interface, DRAM memory controllers and a compact 256‑pin PBGA package, providing a balanced combination of integration, peripheral support and extended operating temperature range.
Key Features
- Core Single embedded MPC8xx 32‑bit core running at 50 MHz for deterministic embedded processing.
- Communications Processor Module (CPM) Integrated CPM with an independent RISC communications processor (CP) that off‑loads peripheral and protocol tasks from the main core.
- Serial channel support CPM supports up to seven serial channels, including SCC(s) for Ethernet/HDLC/ATM, a USB channel, two SMCs, an I2C port and an SPI interface.
- On‑chip peripherals Single 10 Mbps Ethernet interface and USB 1.x support, plus HDLC/SDLC protocol handling via the CPM.
- Memory and bus DRAM controller support and an on‑chip dual‑port RAM (series documentation references an 8‑Kbyte dual‑port RAM) to aid data buffering and inter‑processor communication.
- Power and I/O 3.3 V I/O voltage level compatible with standard embedded peripherals.
- Package and mounting 256‑PBGA (23×23) / 256‑BBGA package, surface mount.
- Industrial qualification Specified operating temperature range of −40°C to 95°C and RoHS compliant for industrial applications.
Typical Applications
- Telecommunications gateways Integrated CPM, Ethernet and HDLC support make the MPC850 suitable for remote‑access and telecom gateway controllers.
- Embedded networking equipment Single‑chip communications processing with DRAM controller and USB enables compact networking modules and interface controllers.
- Industrial controllers Industrial temperature rating and a robust communications peripheral set support deployment in harsh or temperature‑sensitive industrial systems.
- Protocol offload and peripheral bridging The CPM’s independent CP can off‑load serial and protocol tasks (SCC, SMC, I2C, SPI), simplifying host software and improving system determinism.
Unique Advantages
- Highly integrated communications subsystem: CPM plus dedicated serial channels, Ethernet and USB provide a comprehensive peripheral set that reduces external component count.
- Off‑load capability for protocol processing: The CPM’s independent communications processor handles HDLC/SDLC and serial protocols, freeing the main core for application tasks.
- Industrial temperature range: Rated from −40°C to 95°C for reliable operation in industrial environments.
- Compact package: 256‑pin PBGA (23×23) minimizes PCB footprint while supporting dense I/O routing for embedded boards.
- Standards‑oriented I/O voltages: 3.3 V I/O levels for compatibility with common embedded peripherals and interfaces.
- RoHS compliant: Meets environmental requirements for lead‑free product designs.
Why Choose MPC850DSLCZQ50BU?
The MPC850DSLCZQ50BU provides a purpose‑built combination of an MPC8xx 32‑bit core and a feature‑rich Communications Processor Module, delivering a single‑chip solution tailored for embedded communications, remote‑access and industrial networking designs. Its integrated serial interfaces, Ethernet and USB support, together with DRAM controller functionality, reduce BOM complexity and simplify system design.
Backed by NXP Semiconductors’ MPC850 family documentation, this device is suited for designers seeking a compact, industrial‑rated processor with dedicated communications off‑load capabilities and predictable performance for long‑term embedded deployments.
Request a quote or submit an inquiry to get pricing and availability for the MPC850DSLCZQ50BU.

Date Founded: 2006
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