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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MPC8358ECZQAGDGA
MPC8358ECZQAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
234
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MPC8358EVRADDDA
MPC8358EVRADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
485
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MPC8358EVRAGDDA
MPC8358EVRAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
692
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MPC8358EVRAGDGA
MPC8358EVRAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
542
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MPC8358EVVAGDGA
MPC8358EVVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
678
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MPC8358EZQADDDA
MPC8358EZQADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
1,513
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MPC8358EZQAGDDA
MPC8358EZQAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
915
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MPC8358EZQAGDGA
MPC8358EZQAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
416
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N/A
MPC8358VRADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
565
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MPC8358VRAGDDA
MPC8358VRAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
1,042
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MPC8358VRAGDGA
MPC8358VRAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
668-BBGA Exposed Pad
Supplier Device Package:
668-PBGA-PGE (29×29)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
884
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MPC8358VVADDEA
MPC8358VVADDEANXP SemiconductorsIC MPU MPC83XX 266MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
387
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MPC8358VVAGDGA
MPC8358VVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
740-LBGA
Supplier Device Package:
740-TBGA (37.5×37.5)
Additional Interfaces:
DUART, HDLC, I2C, PCI, SPI, UART
642
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MPC8358ZQADDDA
MPC8358ZQADDDANXP SemiconductorsIC MPU MPC83XX 266MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Mounting Type:
Surface Mount
533
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MPC8358ZQAGDDA
MPC8358ZQAGDDANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
186
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MPC8358ZQAGDGA
MPC8358ZQAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 668BGAMicroprocessors668-PBGA-PGE (29x29)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
79
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MPC8360CVVAGDGA
MPC8360CVVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
830
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MPC8360CVVAJDGA
MPC8360CVVAJDGANXP SemiconductorsIC MPU MPC83XX 533MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Mounting Type:
Surface Mount
320
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MPC8360CZUAJDGA
MPC8360CZUAJDGANXP SemiconductorsIC MPU MPC83XX 533MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Mounting Type:
Surface Mount
98
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MPC8360ECVVAGDGA
MPC8360ECVVAGDGANXP SemiconductorsIC MPU MPC83XX 400MHZ 740TBGAMicroprocessors740-TBGA (37.5x37.5)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
902
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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