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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MPC8347VRADD
MPC8347VRADDNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
286
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MPC8347VRADDB
MPC8347VRADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
770
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MPC8347VRAGD
MPC8347VRAGDNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
904
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MPC8347VRAGDB
MPC8347VRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
327
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MPC8347VVAGDB
MPC8347VVAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
408
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MPC8347VVAJDB
MPC8347VVAJDBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
1,993
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MPC8347VVAJFB
MPC8347VVAJFBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
550
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MPC8347VVALFB
MPC8347VVALFBNXP SemiconductorsIC MPU MPC83XX 667MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
291
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MPC8347ZQADDB
MPC8347ZQADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
903
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MPC8347ZQAGD
MPC8347ZQAGDNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
32
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MPC8347ZQAGDB
MPC8347ZQAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
524
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MPC8347ZUAJDB
MPC8347ZUAJDBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
46
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MPC8349CVVAJDB
MPC8349CVVAJDBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Mounting Type:
Surface Mount
667
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MPC8349CZUAGDB
MPC8349CZUAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 672LBGAMicroprocessors672-LBGA (35x35)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
489
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MPC8349CZUAJDB
MPC8349CZUAJDBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
426
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MPC8349ECVVAGDB
MPC8349ECVVAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
220
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MPC8349ECVVAJDB
MPC8349ECVVAJDBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
180
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MPC8349ECVVAJFB
MPC8349ECVVAJFBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Mounting Type:
Surface Mount
1,519
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MPC8349ECZUAJDB
MPC8349ECZUAJDBNXP SemiconductorsIC MPU MPC83XX 533MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
613
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MPC8349EVVAGD
MPC8349EVVAGDNXP SemiconductorsIC MPU MPC83XX 400MHZ 672LBGAMicroprocessors672-LBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
672-LBGA
Supplier Device Package:
672-LBGA (35×35)
118
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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