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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | PRIXP423BD | Intel | IC MPU INTEL 533MHZ PBGA492 | Microprocessors | 492-PBGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Intel® IXP42X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, DES, MD5, SHA-1 Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-PBGA (35×35) Additional Interfaces: HDLC, HSS, PCI, UART, UTOPIA 2 | 946 | ||
![]() | PRIXP425BC | Intel | IC MPU 400MHZ 492BGA | Microprocessors | 492-BGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35×35) Additional Interfaces: HSS, MII, PCI, UART, UTOPIA 2 | 215 | ||
![]() | PS32V234CMN1AVUB | NXP Semiconductors | IC MPU 1.0GHZ/133MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 1.0GHz, 133MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU Ethernet: 1Gbps Voltage – I/O: 1.0V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 562 | ||
| N/A | N/A | QCIXP1200GA | Intel | IC MPU 166MHZ 432BGA | Microprocessors | 432-BGA (40x40) | N/A | 0°C ~ 70°C (TA) | Core Processor: StrongARM Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Co-Processors/DSP: Data; Microengine RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 432-BGA Supplier Device Package: 432-BGA (40×40) | 1,021 | |
![]() | R7S721000VCBG#AC0 | Renesas | IC MPU RZ/A1H 400MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 467 | ||
![]() | R7S721000VCBG#AC1 | Renesas | IC MPU RZ/A1H 400MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 843 | ||
| N/A | N/A | R7S721000VCFP#AA0 | Renesas | IC MPU RZ/A1H 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) Additional Interfaces: CANbus, EBI/EMI, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 205 | |
![]() | R7S721000VCFP#AA1 | Renesas | IC MPU RZ/A1H 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 710 | ||
![]() | R7S721000VLFP#AA0 | Renesas | IC MPU RZ/A1H 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 214 | ||
![]() | R7S721001VCBG#AC0 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 567 | ||
| R7S721001VCBG#AC1 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 234 | |||
![]() | R7S721001VLBG#AC0 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 480 | ||
| N/A | N/A | R7S721001VLBG#AC1 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CANbus, EBI/EMI, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,071 | |
![]() | R7S721010VCBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 676 | ||
![]() | R7S721010VCFP#AA0 | Renesas | IC MPU RZ/A1M 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,041 | ||
![]() | R7S721010VLFP#AA0 | Renesas | IC MPU RZ/A1M 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 649 | ||
![]() | R7S721011VCBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,408 | ||
![]() | R7S721011VLBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 134 | ||
![]() | R7S721020VCBG#AC1 | Renesas | IC MPU RZ/A1L 400MHZ 176LFBGA | Microprocessors | 176-LFBGA (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 176-LFBGA Supplier Device Package: 176-LFBGA (8×8) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 261 | ||
![]() | R7S721020VCFP#AA1 | Renesas | IC MPU RZ/A1L 400MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Supplier Device Package: 176-LFQFP (24×24) Additional Interfaces: CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 534 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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