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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | PRIXP423BD | Intel | IC MPU INTEL 533MHZ PBGA492 | Microprocessors | 492-PBGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Intel® IXP42X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, DES, MD5, SHA-1 Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-PBGA (35×35) Grade: Commercial | 1,782 | ||
 | PRIXP425BC | Intel | IC MPU 400MHZ 492BGA | Microprocessors | 492-BGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35×35) Grade: Commercial | 436 | ||
 | PS32V234CMN1AVUB | NXP Semiconductors | IC MPU 1.0GHZ/133MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 1.0GHz, 133MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU Ethernet: 1Gbps Voltage – I/O: 1.0V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,317 | ||
| N/A | N/A | QCIXP1200GA | Intel | IC MPU 166MHZ 432BGA | Microprocessors | 432-BGA (40x40) | N/A | 0°C ~ 70°C (TA) | Core Processor: StrongARM Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Co-Processors/DSP: Data; Microengine RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 432-BGA Supplier Device Package: 432-BGA (40×40) Grade: Commercial | 333 | |
 | R7S721000VCBG#AC0 | Renesas | IC MPU RZ/A1H 400MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) | 540 | ||
 | R7S721000VCBG#AC1 | Renesas | IC MPU RZ/A1H 400MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) | 286 | ||
| N/A | N/A | R7S721000VCFP#AA0 | Renesas | IC MPU RZ/A1H 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) | 148 | |
 | R7S721000VCFP#AA1 | Renesas | IC MPU RZ/A1H 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) | 423 | ||
 | R7S721000VLFP#AA0 | Renesas | IC MPU RZ/A1H 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) | 835 | ||
 | R7S721001VCBG#AC0 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) | 783 | ||
 | R7S721001VCBG#AC1 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) | 71 | ||
 | R7S721001VLBG#AC0 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) | 1,355 | ||
| N/A | N/A | R7S721001VLBG#AC1 | Renesas | IC MPU RZ/A1H 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) | 830 | |
 | R7S721010VCBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) | 1,765 | ||
 | R7S721010VCFP#AA0 | Renesas | IC MPU RZ/A1M 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) | 574 | ||
 | R7S721010VLFP#AA0 | Renesas | IC MPU RZ/A1M 400MHZ 256LQFP | Microprocessors | 256-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-LQFP (28×28) | 530 | ||
 | R7S721011VCBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) | 1,000 | ||
 | R7S721011VLBG#AC0 | Renesas | IC MPU RZ/A1M 400MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: DVD, VDC Ethernet: 10/100Mbps (1), 100Mbps (1) USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) | 822 | ||
 | R7S721020VCBG#AC1 | Renesas | IC MPU RZ/A1L 400MHZ 176LFBGA | Microprocessors | 176-LFBGA (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 176-LFBGA Supplier Device Package: 176-LFBGA (8×8) | 847 | ||
 | R7S721020VCFP#AA1 | Renesas | IC MPU RZ/A1L 400MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: SDRAM, SRAM Graphics Acceleration: Yes Display & Interface Controllers: VDC Ethernet: 10/100Mbps USB: USB 2.0 (2) Voltage – I/O: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Supplier Device Package: 176-LFQFP (24×24) | 437 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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