Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7S921046VCBG#AC0R7S921046VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
446
R7S921046VCBG#BC0R7S921046VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
249
R7S921047VCBG#AC0R7S921047VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
1,423
R7S921047VCBG#BC0R7S921047VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
413
R7S921048VCBG#AC0R7S921048VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
344
R7S921048VCBG#BC0R7S921048VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
105
R7S921051VCBG#AC0R7S921051VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
999
R7S921051VCBG#BC0R7S921051VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
410
R7S921052VCBG#AC0R7S921052VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
873
R7S921052VCBG#BC0R7S921052VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
168
R7S921053VCBG#AC0R7S921053VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
926
R7S921053VCBG#BC0R7S921053VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
749
R7S921056VCBG#AC0R7S921056VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
194
R7S921056VCBG#BC0R7S921056VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
1,459
R7S921057VCBG#AC0R7S921057VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
142
R7S921057VCBG#BC0R7S921057VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
88
R7S921058VCBG#AC0R7S921058VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
768
R7S921058VCBG#BC0R7S921058VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
110
R80188R80188Advanced Micro DevicesIC MPU 8MHZ 68CLCCMicroprocessors68-CLCC (24.13x24.13)N/A0°C ~ 70°C (TA)
Core Processor:
80188
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-CLCC
Supplier Device Package:
68-CLCC (24.13×24.13)
Grade:
Commercial
1,013
R80188-10R80188-10Advanced Micro DevicesIC MPU 10MHZ 68CLCCMicroprocessors68-CLCC (24.13x24.13)N/A0°C ~ 70°C (TA)
Core Processor:
80188
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-CLCC
Supplier Device Package:
68-CLCC (24.13×24.13)
Grade:
Commercial
231

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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