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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | R7S921046VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 173 | ||
![]() | R7S921046VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 278 | ||
![]() | R7S921047VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 272-FBGA Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,492 | ||
![]() | R7S921047VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 272-FBGA Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 577 | ||
![]() | R7S921048VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 458 | ||
![]() | R7S921048VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 259 | ||
![]() | R7S921051VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 171 | ||
![]() | R7S921051VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 463 | ||
| R7S921052VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 272-FBGA Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,242 | |||
![]() | R7S921052VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 272-FBGA Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 442 | ||
| R7S921053VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 493 | |||
![]() | R7S921053VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 17 | ||
![]() | R7S921056VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,311 | ||
![]() | R7S921056VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 256LFBGA | Microprocessors | 256-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 444 | ||
![]() | R7S921057VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 272-FBGA Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 809 | ||
![]() | R7S921057VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 272FBGA | Microprocessors | 272-FBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 272-FBGA Supplier Device Package: 272-FBGA (17×17) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 749 | ||
![]() | R7S921058VCBG#AC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,362 | ||
![]() | R7S921058VCBG#BC0 | Renesas | IC MPU RZ/A2M 528MHZ 324FBGA | Microprocessors | 324-FBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 528MHz Co-Processors/DSP: Multimedia; NEON™ MPE Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPICSI2, Video USB: USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 Mounting Type: Surface Mount Package / Case: 324-FBGA Supplier Device Package: 324-FBGA (19×19) Additional Interfaces: CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | 1,636 | ||
![]() | R80188 | Advanced Micro Devices | IC MPU 8MHZ 68CLCC | Microprocessors | 68-CLCC (24.13x24.13) | N/A | 0°C ~ 70°C (TA) | Core Processor: 80188 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 8MHz Graphics Acceleration: No Voltage – I/O: 5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-CLCC Supplier Device Package: 68-CLCC (24.13×24.13) Additional Interfaces: DMA, EBI/EMI | 967 | ||
![]() | R80188-10 | Advanced Micro Devices | IC MPU 10MHZ 68CLCC | Microprocessors | 68-CLCC (24.13x24.13) | N/A | 0°C ~ 70°C (TA) | Core Processor: 80188 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 10MHz Graphics Acceleration: No Voltage – I/O: 5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-CLCC Supplier Device Package: 68-CLCC (24.13×24.13) Additional Interfaces: DMA, EBI/EMI | 225 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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