Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7S721020VLFP#AA0N/AR7S721020VLFP#AA0RenesasIC MPU RZ/A1L 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
1,414
R7S721020VLFP#AA1R7S721020VLFP#AA1RenesasIC MPU RZ/A1L 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
958
R7S721021VCFP#AA1R7S721021VCFP#AA1RenesasIC MPU RZ/A1L 400MHZ 208LFQFPMicroprocessors208-LFQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
Supplier Device Package:
208-LFQFP (28×28)
1,098
R7S721021VLFP#AA1R7S721021VLFP#AA1RenesasIC MPU RZ/A1L 400MHZ 208LFQFPMicroprocessors208-LFQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
Supplier Device Package:
208-LFQFP (28×28)
1,303
R7S721030VCBG#AC0R7S721030VCBG#AC0RenesasIC MPU RZ/A1LU 400MHZ 176LFBGAMicroprocessors176-LFBGA (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (8×8)
498
R7S721030VCFP#AA0R7S721030VCFP#AA0RenesasIC MPU RZ/A1LU 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
823
R7S721030VLFP#AA0N/AR7S721030VLFP#AA0RenesasIC MPU RZ/A1LU 400MHZ 176LFQFPMicroprocessors176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP
Supplier Device Package:
176-LFQFP (24×24)
548
R7S721031VCBG#AC0R7S721031VCBG#AC0RenesasIC MPU RZ/A1LU 400MHZ 233FBGAMicroprocessors233-FBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
233-FBGA
Supplier Device Package:
233-FBGA (15×15)
1,223
R7S721031VCFP#AA0R7S721031VCFP#AA0RenesasIC MPU RZ/A1LU 400MHZ 208LFQFPMicroprocessors208-LFQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps (1), 100Mbps (1)
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
Supplier Device Package:
208-LFQFP (28×28)
1,305
R7S721034VCBG#AC0R7S721034VCBG#AC0RenesasIC MPU RZ/A1LC 400MHZ 176LFBGAMicroprocessors176-LFBGA (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
VDC
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (8×8)
730
R7S921040VCBG#AC0R7S921040VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 176LFBGAMicroprocessors176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (13×13)
345
R7S921040VCBG#BC0R7S921040VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 176LFBGAMicroprocessors176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (13×13)
712
R7S921041VCBG#AC0R7S921041VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
205
R7S921041VCBG#BC0R7S921041VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 256LFBGAMicroprocessors256-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
256-LFBGA
Supplier Device Package:
256-LFBGA (11×11)
880
R7S921042VCBG#AC0R7S921042VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
438
R7S921042VCBG#BC0R7S921042VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 272FBGAMicroprocessors272-FBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
272-FBGA
Supplier Device Package:
272-FBGA (17×17)
741
R7S921043VCBG#AC0R7S921043VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
1,695
R7S921043VCBG#BC0R7S921043VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 324FBGAMicroprocessors324-FBGA (19x19)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
324-FBGA
Supplier Device Package:
324-FBGA (19×19)
1,204
R7S921045VCBG#AC0R7S921045VCBG#AC0RenesasIC MPU RZ/A2M 528MHZ 176LFBGAMicroprocessors176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (13×13)
326
R7S921045VCBG#BC0R7S921045VCBG#BC0RenesasIC MPU RZ/A2M 528MHZ 176LFBGAMicroprocessors176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPICSI2, Video
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256
Mounting Type:
Surface Mount
Package / Case:
176-LFBGA
Supplier Device Package:
176-LFBGA (13×13)
194

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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