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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | R80286-8S | Advanced Micro Devices | IC MPU 8MHZ 68CLCC | Microprocessors | 68-CLCC (24.13x24.13) | N/A | 0°C ~ 85°C (TC) | Core Processor: 80286 Number of Cores/Bus Width: 1 Core Speed: 8MHz Graphics Acceleration: No Voltage – I/O: 5V Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 68-CLCC Supplier Device Package: 68-CLCC (24.13×24.13) | 851 | ||
 | R80C188XL20 | Intel | IC MPU I186 20MHZ 68PLCC | Microprocessors | 68-PLCC | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 20MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC | 787 | ||
 | R8A77210C133BAV | Renesas | IC MPU SUPERH 133MHZ 256BGA | Microprocessors | 256-LFBGA (11x11) | N/A | -20°C ~ 75°C (TA) | Core Processor: SH-3 DSP Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Voltage – I/O: 3.3V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (11×11) | 759 | ||
| N/A | R8A77210C133BGV | Renesas | IC MPU SUPERH SH7700 133MHZ | Microprocessors | N/A | N/A | -20°C ~ 75°C (TA) | Core Processor: SH-3 DSP Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Voltage – I/O: 3.3V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Package / Case: 81-LFBGA | 187 | ||
 | R8A77220AC266BAV | Renesas | IC MPU SUPERH 266MHZ 417BGA | Microprocessors | 417-LFBGA (13x13) | 3.30V | -20°C – 75°C | Core Processor: SH-4AL-DSP Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Mounting Type: Surface Mount | 163 | ||
 | N/A | R8A77220AC266BGV | Renesas | IC MPU SUPERH 266MHZ 449FBGA | Microprocessors | 449-FBGA (21x21) | N/A | -20°C ~ 75°C (TA) | Core Processor: SH-4AL-DSP Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Voltage – I/O: 3.30V Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Package / Case: 449-FBGA Supplier Device Package: 449-FBGA (21×21) | 1,258 | |
 | R8A77420HA02BG#UA | Renesas | IC MPU RZ/G/G1H | Microprocessors | N/A | N/A | – | Core Processor: Quad ARM® Cortex®-A7, Quad ARM® Cortex®-A15 SATA: SATA 3Gbps (2) USB: USB 2.0 (2), USB 3.0 (1) | 1,507 | ||
| N/A | R8A77430HA01BG#UA | Renesas | IC MPU RZ/G/G1M 1.5GHZ | Microprocessors | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A15 Speed: 1.5GHz Operating Temperature: -40°C ~ 85°C (TA) | 1,423 | ||
 | R8A77430HA02BG#UA | Renesas | IC MPU RZ/G/G1M 1.5GHZ | Microprocessors | N/A | N/A | – | Speed: 1.5GHz | 1,116 | ||
| N/A | R8A77440HA01BG#UA | Renesas | IC MPU RZ/G/G1N 1.5GHZ | Microprocessors | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A15 Speed: 1.5GHz Operating Temperature: -40°C ~ 85°C (TA) | 999 | ||
 | R8A77440HA02BG#UA | Renesas | IC MPU RZ/G/G1N 1.5GHZ | Microprocessors | N/A | N/A | – | Speed: 1.5GHz | 240 | ||
| N/A | R8A77450HA01BG#UA | Renesas | IC MPU RZ/G/G1E 1GHZ 501FBGA | Microprocessors | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Speed: 1GHz Operating Temperature: -40°C ~ 85°C (TA) | 342 | ||
 | R8A77450HA02BG#UA | Renesas | IC MPU RZ/G/G1E 1GHZ | Microprocessors | N/A | N/A | – | Speed: 1GHz | 1,729 | ||
 | R8A774A0HA01BG#G2 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA (29x29) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 6 Core, 64-Bit Speed: 1.2GHz, 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB (2) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 1022-BGA Supplier Device Package: 1022-FPBGA (29×29) Additional Interfaces: CAN, I2C, SCI, SPI | 930 | ||
 | N/A | R8A774A0HA01BG#U2 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA (29x29) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 6 Core, 64-Bit Speed: 1.2GHz, 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB (2) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 1022-BGA Supplier Device Package: 1022-FPBGA (29×29) Additional Interfaces: CAN, I2C, SCI, SPI | 783 | |
 | N/A | R8A774A1HA01BG#G2 | Renesas | IC MCU 32BIT ARM 1022FPBGA | Microprocessors | N/A | N/A | N/A | N/A | 1,148 | |
| N/A | R8A774A2HA01BG#G7 | Renesas | SOC RZ/G2M HDMI OFF (FULL) | Microprocessors | N/A | N/A | N/A | N/A | 1,871 | ||
| N/A | N/A | R8A774A2HA01BG#GV | Renesas | SOC RZ/G2M HDMI OFF (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 2 Core, 64-Bit Speed: 1.2GHz, 1.5GHz Co-Processors/DSP: ARM® Cortex®-R7 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HMI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 219 | |
| N/A | R8A774A2HA01BG#U7 | Renesas | SOC RZ/G2M HDMI OFF (BULK) | Microprocessors | N/A | N/A | N/A | N/A | 497 | ||
| N/A | R8A774A2HA01BG#UV | Renesas | SOC RZ/G2M HDMI OFF (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 2 Core, 64-Bit Speed: 1.2GHz, 1.5GHz Co-Processors/DSP: ARM® Cortex®-R7 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HMI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) Additional Interfaces: CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART | 649 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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