Microprocessors

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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
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N/AR8A774E0HA01BN#YJCRenesasSOC RZ/G2H HDMI OFF (WS)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DU
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
1,010
R8A774E1HA01BN#G0N/AR8A774E1HA01BN#G0RenesasIC MCU 32BIT ARM 1022FPBGAMicroprocessors1022-FCBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.2 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-R7
Display & Interface Controllers:
LVDS, MIPI-CSI
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
882
N/AN/AR8A774E1HA01BN#G6RenesasSOC RZ/G2H HDMI ON (FULL)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100Mbps (1)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
714
R8A774E1HA01BN#U0N/AR8A774E1HA01BN#U0RenesasIC MCU 32BIT ARM 1022FPBGAMicroprocessors1022-FCBGA (29x29)N/A-40 °C – 85 °C
Speed:
1.2 GHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Graphics Acceleration:
Yes
Co-Processors/DSP:
ARM® Cortex®-R7
Display & Interface Controllers:
LVDS, MIPI-CSI
SATA:
SATA 16Gbps (1)
Qualification:
Industrial
232
N/AN/AR8A774E1HA01BN#U6RenesasSOC RZ/G2H HDMI ON (BULK)Microprocessors1022-FCBGA (29x29)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width:
4, 4 Core, 64-Bit
Speed:
1.2GHz, 1.5GHz
Co-Processors/DSP:
ARM® Cortex®-R7
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS, MIPI-CSI
Ethernet:
10/100Mbps (1)
SATA:
SATA 16Gbps (1)
USB:
USB 2.0 OTG (2), USB 3.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C
Security Features:
AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
Mounting Type:
Surface Mount
Package / Case:
1022-BFBGA, FCBGA
Supplier Device Package:
1022-FCBGA (29×29)
1,836
R8A77800BDBGVR8A77800BDBGVRenesasIC MPU SUPERH 400MHZ 449FBGAMicroprocessors449-FBGA (21x21)N/A-20 °C – 75 °C
Speed:
400 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
SH-4A
Number of Cores/Bus Width:
1 Core, 32-Bit
Graphics Acceleration:
No
Qualification:
Consumer
415
R8A77800BNBGVR8A77800BNBGVRenesasIC MPU SUPERH 400MHZ 449FBGAMicroprocessors449-FBGA (21x21)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4A
Speed:
400MHz
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
449-FBGA
Supplier Device Package:
449-FBGA (21×21)
1,395
N/AN/AR8A77860HBGVRenesasIC MPU 533MHZ 593HFBGAMicroprocessors593-HFBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4A
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
IEEE 802.3u
USB:
USB 2.0
Voltage – I/O:
1.25V, 1.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
593-BFBGA
Supplier Device Package:
593-HFBGA (25×25)
355
N/AN/AR8A77860HBGV#U0RenesasIC MPU 533MHZ 593HFBGAMicroprocessors593-HFBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4A
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
IEEE 802.3u
USB:
USB 2.0
Voltage – I/O:
1.25V, 1.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
593-BFBGA
Supplier Device Package:
593-HFBGA (25×25)
958
N/AN/AR8A77860NBGVRenesasIC MPU 533MHZ 593HFBGAMicroprocessors593-HFBGA (25x25)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-4A
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
IEEE 802.3u
USB:
USB 2.0
Voltage – I/O:
1.25V, 1.5V, 3.3V
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
593-BFBGA
Supplier Device Package:
593-HFBGA (25×25)
812
N/AR9A06G032EGBA#AC1RenesasSOC RZ/N1D 324PIN SEC NOREDUNDMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
Boot Security, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
76
N/AR9A06G032EGBG#AC1RenesasIC MPU RZ/N1D 500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
1,545
R9A06G032NGBG#AC0N/AR9A06G032NGBG#AC0RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
1,742
R9A06G032NGBG#AC1R9A06G032NGBG#AC1RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
1,557
N/AN/AR9A06G032PGBG#AC0RenesasICMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
Boot Security, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
1,020
N/AR9A06G032PGBG#AC1RenesasIC MPU RZ/N1D 500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
1,163
R9A06G032VGBA#AC0R9A06G032VGBA#AC0RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
431
R9A06G032VGBA#AC1R9A06G032VGBA#AC1RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
572
R9A06G032VGBG#AC0R9A06G032VGBG#AC0RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
535
R9A06G032VGBG#AC1R9A06G032VGBG#AC1RenesasIC MPU RZ 125/500MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
923

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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