Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AR9A06G033EGBA#AC1RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
1,333
R9A06G033NGBG#AC0R9A06G033NGBG#AC0RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
428
R9A06G033NGBG#AC1R9A06G033NGBG#AC1RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
1,284
N/AN/AR9A06G033PGBG#AC0RenesasICMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
827
N/AR9A06G033PGBG#AC1RenesasSOC RZ/N1S 324PIN SECURITYMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
1,323
N/AN/AR9A06G033SGBA#BC0RenesasICMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (5)
USB:
USB 2.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
204
R9A06G033VGBA#AC0R9A06G033VGBA#AC0RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
319
R9A06G033VGBA#AC1R9A06G033VGBA#AC1RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
412
R9A06G034VGBA#AC0R9A06G034VGBA#AC0RenesasIC MPU RZ/N1L 125MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
125MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
758
R9A06G034VGBA#AC1R9A06G034VGBA#AC1RenesasIC MPU RZ/N1L 125MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
125MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
145
R9A06G043GBG#AC0R9A06G043GBG#AC0RenesasIC MPU 150MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
150MHz
Graphics Acceleration:
No
Ethernet:
EtherCAT (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
662
R9A07G043F00GBG#AC0R9A07G043F00GBG#AC0RenesasIC MPU RZ/G 1GHZ 266BGAMicroprocessors266-BGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-BGA
Supplier Device Package:
266-BGA (11×11)
104
R9A07G043F00GBG#BC0R9A07G043F00GBG#BC0RenesasIC MPU RZ/G 1GHZ 266BGAMicroprocessors266-BGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-BGA
Supplier Device Package:
266-BGA (11×11)
557
R9A07G043F01GBG#AC0R9A07G043F01GBG#AC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
500
R9A07G043F01GBG#BC0R9A07G043F01GBG#BC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
252
N/AR9A07G043F04GBG#AC0RenesasIC MPU RZ/G 1GHZ 266LFBGAMicroprocessors266-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-LFBGA
Supplier Device Package:
266-LFBGA (11×11)
1,205
N/AR9A07G043F04GBG#BC0RenesasIC MPU RZ/G 1GHZ 266LFBGAMicroprocessors266-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-LFBGA
Supplier Device Package:
266-LFBGA (11×11)
180
N/AR9A07G043F05GBG#AC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
317
N/AR9A07G043F05GBG#BC0RenesasIC MPU RZ/G 1GHZ 361LFBGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
1,089
R9A07G043U11GBG#AC0R9A07G043U11GBG#AC0RenesasIC MPU RZ/G 200MHZ/1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
200MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR4, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
57

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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