Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
R9A06G033EGBA#AC1RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,671
R9A06G033NGBG#AC0
R9A06G033NGBG#AC0RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
887
R9A06G033NGBG#AC1
R9A06G033NGBG#AC1RenesasIC MPU RZ 125/500MHZ 324LFBGAMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
1,579
N/AN/AR9A06G033PGBG#AC0RenesasICMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,054
N/A
R9A06G033PGBG#AC1RenesasSOC RZ/N1S 324PIN SECURITYMicroprocessors324-LFBGA (15x15)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-LFBGA (15×15)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
195
N/AN/AR9A06G033SGBA#BC0RenesasICMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (5)
USB:
USB 2.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Security Features:
Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CANbus, I2C, SPI, UART
564
R9A06G033VGBA#AC0
R9A06G033VGBA#AC0RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
1,602
R9A06G033VGBA#AC1
R9A06G033VGBA#AC1RenesasIC MPU RZ 125/500MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M3
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
125MHz, 500MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
992
R9A06G034VGBA#AC0
R9A06G034VGBA#AC0RenesasIC MPU RZ/N1L 125MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
125MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
993
R9A06G034VGBA#AC1
R9A06G034VGBA#AC1RenesasIC MPU RZ/N1L 125MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
125MHz
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps
USB:
USB 2.0 (2)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
1,016
R9A06G043GBG#AC0
R9A06G043GBG#AC0RenesasIC MPU 150MHZ 196LFBGAMicroprocessors196-LFBGA (12x12)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
150MHz
Graphics Acceleration:
No
Ethernet:
EtherCAT (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
196-LFBGA
Supplier Device Package:
196-LFBGA (12×12)
Additional Interfaces:
CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
354
R9A07G043F00GBG#AC0
R9A07G043F00GBG#AC0RenesasIC MPU RZ/G 1GHZ 266BGAMicroprocessors266-BGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-BGA
Supplier Device Package:
266-BGA (11×11)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,212
R9A07G043F00GBG#BC0
R9A07G043F00GBG#BC0RenesasIC MPU RZ/G 1GHZ 266BGAMicroprocessors266-BGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-BGA
Supplier Device Package:
266-BGA (11×11)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,267
R9A07G043F01GBG#AC0
R9A07G043F01GBG#AC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
448
R9A07G043F01GBG#BC0
R9A07G043F01GBG#BC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
132
N/A
R9A07G043F04GBG#AC0RenesasIC MPU RZ/G 1GHZ 266LFBGAMicroprocessors266-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-LFBGA
Supplier Device Package:
266-LFBGA (11×11)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
147
N/A
R9A07G043F04GBG#BC0RenesasIC MPU RZ/G 1GHZ 266LFBGAMicroprocessors266-LFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (1)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
266-LFBGA
Supplier Device Package:
266-LFBGA (11×11)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
1,737
N/A
R9A07G043F05GBG#AC0RenesasIC MPU RZ/G 1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
121
N/A
R9A07G043F05GBG#BC0RenesasIC MPU RZ/G 1GHZ 361LFBGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
AndesCore™ AX45MP
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
1GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
278
R9A07G043U11GBG#AC0
R9A07G043U11GBG#AC0RenesasIC MPU RZ/G 200MHZ/1GHZ 361BGAMicroprocessors361-BGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
200MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR4, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
GbE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-BGA (13×13)
Additional Interfaces:
CANbus, eMMC/SD/SDIO, I2C, SPI, UART
313

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.

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