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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | R9A07G044L17GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,089 | ||
| N/A | R9A07G044L17GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,002 | ||
| N/A | R9A07G044L18GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 51 | ||
| N/A | R9A07G044L18GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 156 | ||
 | R9A07G044L23GBG#AC0 | Renesas | IC MPU 1.2GHZ 456BGA | Microprocessors | 456-BGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 456-BGA Supplier Device Package: 456-BGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 56 | ||
 | R9A07G044L23GBG#BC0 | Renesas | SOC RZ/G2L 15MMBGA NON-SECUE DUA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 429 | ||
| N/A | R9A07G044L23GBG#YJ0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,260 | ||
 | R9A07G044L24GBG#AC0 | Renesas | IC MPU 1.2GHZ 551BGA | Microprocessors | 551-BGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 551-BGA Supplier Device Package: 551-BGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 802 | ||
 | R9A07G044L24GBG#BC0 | Renesas | SOC RZ/G2L 21MMBGA NON-SECUE DUA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,343 | ||
| N/A | R9A07G044L24GBG#YJ0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 578 | ||
| N/A | R9A07G044L27GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,172 | ||
| N/A | R9A07G044L27GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,515 | ||
| N/A | R9A07G044L28GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 390 | ||
| N/A | R9A07G044L28GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 709 | ||
| N/A | R9A07G054L13GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 499 | ||
| N/A | R9A07G054L13GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 715 | ||
| N/A | R9A07G054L14GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 51 | ||
| N/A | R9A07G054L14GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 400 | ||
| N/A | R9A07G054L17GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,549 | ||
| N/A | R9A07G054L17GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 119 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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