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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | R9A07G054L18GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 446 | ||
| N/A | R9A07G054L18GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 634 | ||
 | R9A07G054L23GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 456LFBGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 660 | ||
| N/A | R9A07G054L23GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 663 | ||
 | N/A | R9A07G054L24GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 551LFBGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 358 | |
| N/A | R9A07G054L24GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 13 | ||
| N/A | R9A07G054L27GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 246 | ||
| N/A | R9A07G054L27GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 632 | ||
| N/A | R9A07G054L28GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 165 | ||
| N/A | R9A07G054L28GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,488 | ||
 | R9A07G063U01GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 87 | ||
 | R9A07G063U01GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 1,532 | ||
 | R9A07G063U02GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 1,492 | ||
 | R9A07G063U02GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 1,527 | ||
| N/A | R9A07G074M01GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT N | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 1,292 | ||
 | R9A07G074M04GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT NON-S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 730 | ||
| N/A | R9A07G074M05GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 368 | ||
| N/A | R9A07G074M08GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT SEC | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 386 | ||
| N/A | R9A07G075M01GFA#AA0 | Renesas | IC MPU RZ 600/800MHZ 128LFQFP | Microprocessors | 128-LFQFP (14x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-LFQFP (14×20) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 94 | ||
| N/A | R9A07G075M01GFP#AA0 | Renesas | IC MPU RZ 600/800MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LFQFP (24×24) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,795 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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