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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | R9A07G054L18GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 1,877 | ||
| N/A | R9A07G054L18GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 1,007 | ||
 | N/A | R9A07G054L23GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 456LFBGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) | 889 | |
| N/A | R9A07G054L23GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) | 64 | ||
 | N/A | R9A07G054L24GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 551LFBGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 351 | |
| N/A | R9A07G054L24GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 1,745 | ||
| N/A | R9A07G054L27GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) | 774 | ||
| N/A | R9A07G054L27GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) | 783 | ||
| N/A | R9A07G054L28GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 1,577 | ||
| N/A | R9A07G054L28GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 88 | ||
 | R9A07G063U01GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) | 651 | ||
 | R9A07G063U01GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) | 1,220 | ||
 | R9A07G063U02GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) | 649 | ||
 | R9A07G063U02GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-PBGA (13×13) | 484 | ||
| N/A | R9A07G074M01GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT N | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) | 618 | ||
 | R9A07G074M04GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT NON-S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) | 22 | ||
| N/A | R9A07G074M05GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) | 919 | ||
| N/A | R9A07G074M08GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT SEC | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 3.0 (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-LFBGA (12×12) | 893 | ||
| N/A | R9A07G075M01GFA#AA0 | Renesas | IC MPU RZ 600/800MHZ 128LFQFP | Microprocessors | 128-LFQFP (14x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-LFQFP (14×20) | 1,572 | ||
| N/A | R9A07G075M01GFP#AA0 | Renesas | IC MPU RZ 600/800MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LFQFP (24×24) | 1,193 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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