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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | R9A08G045S15GBG#BC0 | Renesas | SOC RZ/G3S 13BGA SECURE(FULL) | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART | 482 | ||
 | R9A08G045S17GBG#AC0 | Renesas | SOC RZ/G3S 14BGA SECURE 1+1CPU(B | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART | 94 | ||
 | R9A08G045S17GBG#BC0 | Renesas | SOC RZ/G3S 14BGA SECURE 1+1CPU(F | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART | 1,039 | ||
 | R9A08G045S35GBG#AC0 | Renesas | SOC RZ/G3S 13BGA SECURE 1+2CPU(B | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART | 1,553 | ||
 | R9A08G045S35GBG#BC0 | Renesas | SOC RZ/G3S 13BGA SECURE 1+2CPU(F | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART | 1,863 | ||
 | R9A08G045S37GBG#AC0 | Renesas | SOC RZ/G3S 14BGA SECURE 1+2CPU(B | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART | 1,142 | ||
 | R9A08G045S37GBG#BC0 | Renesas | SOC RZ/G3S 14BGA SECURE 1+2CPU(F | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART | 87 | ||
| N/A | N/A | R9A09G011GBG#ACC | Renesas | IC MPU RZ/V 996MHZ 841FBGA | Microprocessors | 841-FBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 996MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DP, HDMI, LCD Ethernet: GbE (1) USB: USB 3.1 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARC4, RSA, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 841-FBGA Supplier Device Package: 841-FBGA (15×15) Additional Interfaces: CSI, GPIO, I2C, PCIe, SDI, USB | 923 | |
| N/A | N/A | R9A09G011GBG#ACV | Renesas | IC MPU RZ/V 996MHZ 841FBGA | Microprocessors | 841-FBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 996MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, HDMI, LCD Ethernet: GbE (1) USB: USB 3.1 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARC4, RSA, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 841-FBGA Supplier Device Package: 841-FBGA (15×15) Additional Interfaces: CSI, GPIO, I2C, PCIe, SDI, USB | 746 | |
| N/A | N/A | R9A09G011GBG#BCC | Renesas | IC MPU RZ/V 996MHZ 841FBGA | Microprocessors | 841-FBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 996MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DP, HDMI, LCD Ethernet: GbE (1) USB: USB 3.1 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARC4, RSA, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 841-FBGA Supplier Device Package: 841-FBGA (15×15) Additional Interfaces: CSI, GPIO, I2C, PCIe, SDI, USB | 426 | |
| N/A | N/A | R9A09G011GBG#BCV | Renesas | IC MPU RZ/V 996MHZ 841FBGA | Microprocessors | 841-FBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 996MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, HDMI, LCD Ethernet: GbE (1) USB: USB 3.1 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARC4, RSA, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 841-FBGA Supplier Device Package: 841-FBGA (15×15) Additional Interfaces: CSI, GPIO, I2C, PCIe, SDI, USB | 591 | |
| N/A | R9A09G055MA3GBG#ACC | Renesas | IC MPU RZ/V2MA 996MHZ 841FBGA | Microprocessors | 841-FBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 996MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DP, HDMI, LCD Ethernet: GbE (1) USB: USB 3.1 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 841-FBGA Supplier Device Package: 841-FBGA (15×15) Additional Interfaces: CSI, GPIO, I2C, PCIe, SDI, UART, USB | 515 | ||
| N/A | R9A09G055MA3GBG#BCC | Renesas | IC MPU RZ/V2MA 996MHZ 841FBGA | Microprocessors | 841-FBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 996MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DP, HDMI, LCD Ethernet: GbE (1) USB: USB 3.1 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 841-FBGA Supplier Device Package: 841-FBGA (15×15) Additional Interfaces: CSI, GPIO, I2C, PCIe, SDI, UART, USB | 160 | ||
 | R9A09G057H41GBG#AC0 | Renesas | RZ/V2H CA55 QUAD 19MM BULK | Microprocessors | N/A | N/A | N/A | N/A | 753 | ||
 | R9A09G057H41GBG#BC0 | Renesas | RZ/V2H CA55 QUAD 19MM FULL | Microprocessors | N/A | N/A | N/A | N/A | 942 | ||
 | R9A09G057H42GBG#AC0 | Renesas | RZ/V2H CA55 QUAD GPU 19MM BULK | Microprocessors | N/A | N/A | N/A | N/A | 625 | ||
 | R9A09G057H42GBG#BC0 | Renesas | RZ/V2H CA55 QUAD GPU 19MM FULL | Microprocessors | N/A | N/A | N/A | N/A | 1,007 | ||
 | R9A09G057H44GBG#AC0 | Renesas | RZ/V2H CA55 QUAD ISP&GPU 19MM BU | Microprocessors | N/A | N/A | N/A | N/A | 105 | ||
 | R9A09G057H44GBG#BC0 | Renesas | RZ/V2H CA55 QUAD ISP&GPU 19MM FU | Microprocessors | N/A | N/A | N/A | N/A | 669 | ||
 | R9A09G057H45GBG#AC0 | Renesas | RZ/V2H CA55 QUAD 19MM SECURE BUL | Microprocessors | N/A | N/A | N/A | N/A | 13 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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