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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | R9A07G075M05GFA#AA0 | Renesas | IC MPU RZ 600/800MHZ 128LFQFP | Microprocessors | 128-LFQFP (14x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-LFQFP (14×20) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 164 | ||
| N/A | R9A07G075M05GFP#AA0 | Renesas | IC MPU RZ 600/800MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LFQFP (24×24) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 666 | ||
| N/A | R9A07G075M22GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 225-LFBGA Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 339 | ||
| N/A | R9A07G075M22GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 320-LFBGA Supplier Device Package: 320-FBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 439 | ||
| N/A | R9A07G075M24GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 225-LFBGA Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 863 | ||
 | R9A07G075M24GBG#AC0 | Renesas | IC MPU 600MHZ/800MHZ 320LFBGA | Microprocessors | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 320-LFBGA Supplier Device Package: 320-LFBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 151 | ||
| N/A | R9A07G075M26GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 225-LFBGA Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,004 | ||
| N/A | R9A07G075M26GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 320-LFBGA Supplier Device Package: 320-FBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,142 | ||
| N/A | R9A07G075M27GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 225-LFBGA Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 879 | ||
| N/A | R9A07G075M28GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 225-LFBGA Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,252 | ||
| N/A | R9A07G075M28GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 600MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 320-LFBGA Supplier Device Package: 320-FBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 120 | ||
| N/A | R9A07G084M04GBA#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 121FBGA | Microprocessors | 121-FBGA (10x10) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz, 400MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-FBGA (10×10) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 717 | ||
 | R9A07G084M04GBG#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz, 400MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 225-LFBGA Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,226 | ||
| N/A | R9A07G084M08GBA#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 121FBGA | Microprocessors | 121-FBGA (10x10) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz, 400MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG Mounting Type: Surface Mount Package / Case: 121-LFBGA Supplier Device Package: 121-FBGA (10×10) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 757 | ||
| N/A | R9A07G084M08GBG#AC0 | Renesas | IC MPU RZ 300/400MHZ 225LFBGA | Microprocessors | 225-LFBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz, 400MHz Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: No Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG Mounting Type: Surface Mount Package / Case: 225-LFBGA Supplier Device Package: 225-LFBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,673 | ||
 | R9A08G045S11GBG#AC0 | Renesas | SOC RZ/G3S 13BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART | 538 | ||
 | R9A08G045S11GBG#BC0 | Renesas | SOC RZ/G3S 13BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART | 229 | ||
 | R9A08G045S13GBG#AC0 | Renesas | SOC RZ/G3S 14BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART | 1,200 | ||
 | R9A08G045S13GBG#BC0 | Renesas | SOC RZ/G3S 14BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART | 1,617 | ||
 | R9A08G045S15GBG#AC0 | Renesas | SOC RZ/G3S 13BGA SECURE(BULK) | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART | 560 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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