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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | R9A07G043U11GBG#BC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: GbE (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 519 | ||
| N/A | R9A07G043U12GBG#AC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: GbE (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 1,067 | ||
| N/A | R9A07G043U12GBG#BC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361LFBGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: GbE (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 45 | ||
| N/A | R9A07G043U15GBG#AC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 958 | ||
| N/A | R9A07G043U15GBG#BC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 447 | ||
| N/A | R9A07G043U16GBG#AC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 617 | ||
| N/A | R9A07G043U16GBG#BC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 1,422 | ||
| N/A | R9A07G044C12GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 1,506 | ||
| N/A | R9A07G044C12GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 533 | ||
| N/A | R9A07G044C16GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 419 | ||
| N/A | R9A07G044C16GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 124 | ||
 | R9A07G044C22GBG#AC0 | Renesas | IC MPU 1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-BGA (13×13) | 439 | ||
| N/A | R9A07G044C22GBG#BC0 | Renesas | IC MPU 1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-BGA (13×13) | 1,196 | ||
| N/A | R9A07G044C22GBG#YJ0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 88 | ||
| N/A | R9A07G044C26GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 818 | ||
| N/A | R9A07G044C26GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) | 534 | ||
| N/A | R9A07G044L13GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) | 87 | ||
| N/A | R9A07G044L13GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) | 166 | ||
| N/A | R9A07G044L14GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 748 | ||
| N/A | R9A07G044L14GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) | 1,738 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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