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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | R9A07G043U11GBG#BC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: GbE (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,411 | ||
| N/A | R9A07G043U12GBG#AC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: GbE (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,343 | ||
| N/A | R9A07G043U12GBG#BC0 | Renesas | IC MPU RZ/G 200MHZ/1GHZ 361LFBGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: GbE (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,752 | ||
| N/A | R9A07G043U15GBG#AC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI | 1,419 | ||
| N/A | R9A07G043U15GBG#BC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI | 1,242 | ||
| N/A | R9A07G043U16GBG#AC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI | 1,488 | ||
| N/A | R9A07G043U16GBG#BC0 | Renesas | IC MPU RZ/G2UL 1GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1GHz Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, ARM TZ, ECC, GHASH, RSA, Secure boot, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, DMA, Ethernet, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SCI | 1,409 | ||
| N/A | R9A07G044C12GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 930 | ||
| N/A | R9A07G044C12GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 490 | ||
| N/A | R9A07G044C16GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 535 | ||
| N/A | R9A07G044C16GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,002 | ||
 | R9A07G044C22GBG#AC0 | Renesas | IC MPU 1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,306 | ||
| N/A | R9A07G044C22GBG#BC0 | Renesas | IC MPU 1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-BGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 510 | ||
| N/A | R9A07G044C22GBG#YJ0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 981 | ||
| N/A | R9A07G044C26GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 904 | ||
| N/A | R9A07G044C26GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 361BGA | Microprocessors | 361-BGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-BGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 558 | ||
| N/A | R9A07G044L13GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 230 | ||
| N/A | R9A07G044L13GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-LFBGA Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 97 | ||
| N/A | R9A07G044L14GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 555 | ||
| N/A | R9A07G044L14GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 200MHz, 1.2GHz Co-Processors/DSP: ARM® Mali-G31 RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 551-LFBGA Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 536 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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