R9A07G043U11GBG#BC0

IC MPU RZ/G 200MHZ/1GHZ 361BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G 4 Core, 64-Bit 200MHz, 1GHz 361-BGA (13x13)

Quantity 519 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G043
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package361-BGA (13x13)
Display & Interface ControllersLCDECCN3A991A2EthernetGbE (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersDDR4, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1GHzSupplier Device Package361-BGA (13×13)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G043U11GBG#BC0 – ARM® Cortex®-A55 / Cortex®-M33 4-Core 64‑Bit MPU, 200 MHz / 1 GHz, 361‑BGA

The R9A07G043U11GBG#BC0 is a Renesas RZ/G microprocessor IC featuring ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit configuration. The device is offered with operating frequencies cited at 200 MHz and 1 GHz and targets embedded applications requiring a combination of application processing and microcontroller-class control.

Qualified for industrial use and specified for an operating temperature range of -40 °C to 85 °C, this surface-mount 361‑LFBGA (13×13) package integrates memory controller support and a range of I/O suitable for networked and secure embedded systems.

Key Features

  • Core Architecture  ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit configuration for partitioned application and control processing.
  • Operating Frequencies  Documented operating points include 200 MHz and 1 GHz to address different performance/ power points.
  • Memory Support  Integrated controllers for DDR4 and DDR3L memory to support system memory needs for application and data buffers.
  • Interfaces  Dual Gigabit Ethernet (GbE) ports, two USB 2.0 ports, and CANbus support provide a broad set of connectivity options for networked embedded designs.
  • Display  On-chip LCD display controller support for embedded human‑machine interfaces and panel displays.
  • Security and Crypto  Hardware security features including AES, ECC, GHASH, RSA, SHA‑1, SHA‑224, SHA‑256, and a TRNG to support secure boot, communications, and data protection.
  • Multimedia Acceleration  DSP and NEON™ SIMD support for multimedia processing and signal acceleration where applicable.
  • Package & Mounting  361‑LFBGA (361‑BGA, 13×13) surface-mount package suitable for compact embedded boards.
  • Industrial Qualification & Temperature Range  Industrial qualification with operating temperature from -40 °C to 85 °C for deployment in industrial environments.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Industrial Control Systems  Use the processor for application logic and control tasks in industrial equipment where industrial qualification and extended temperature range are required.
  • Embedded Networking  Dual GbE and CANbus make the device suitable for networked embedded nodes, gateways, and communication controllers.
  • Human‑Machine Interfaces (HMI)  LCD controller and multimedia processing capabilities support display-driven operator interfaces and control panels.
  • Secure Edge Devices  On-chip cryptographic primitives and TRNG support secure communications, authentication, and data integrity for edge appliances and IoT gateways.

Unique Advantages

  • Heterogeneous Core Balance: Combines ARM® Cortex®-A55 and Cortex®-M33 cores to separate high‑level application processing from low‑level control tasks.
  • Integrated Connectivity: Dual GbE, USB 2.0, and CANbus reduce external interface components and simplify board-level design.
  • Built‑in Security Engines: AES, RSA, SHA family, ECC, GHASH and TRNG provide hardware-accelerated security functions for protected systems.
  • Flexible Memory Options: Support for DDR4 and DDR3L memory controllers enables scalable system memory configurations.
  • Industrial‑Ready Packaging: 361‑LFBGA surface-mount package and an operating range to -40 °C to 85 °C support deployment in industrial environments.
  • Standards Compliance: RoHS compliance supports regulatory and environmental requirements for product design.

Why Choose R9A07G043U11GBG#BC0?

The R9A07G043U11GBG#BC0 positions itself as a versatile embedded microprocessor solution combining 64‑bit application cores with microcontroller-class cores, integrated memory interface options, comprehensive connectivity, and hardware security features. Its industrial qualification and extended temperature rating make it suitable for demanding embedded deployments.

This device is well suited to design teams building industrial control systems, networked edge devices, HMIs, and secure embedded platforms that require integrated interfaces, hardware security acceleration, and support for DDR4/DDR3L memory configurations.

Request a quote or submit a request for pricing and availability to begin specifying the R9A07G043U11GBG#BC0 for your next embedded design.

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