R9A07G043U11GBG#AC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G 4 Core, 64-Bit 200MHz, 1GHz 361-BGA (13x13) |
|---|---|
| Quantity | 57 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G043 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 361-BGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | GbE (2) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 361-LFBGA | RAM Controllers | DDR4, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG | ||
| Speed | 200MHz, 1GHz | Supplier Device Package | 361-BGA (13×13) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G043U11GBG#AC0 – ARM® Cortex®-A55 / Cortex®-M33 4-Core 64‑Bit MPU (200MHz / 1GHz), 361‑BGA
The R9A07G043U11GBG#AC0 is a Renesas RZ/G series microprocessor integrating ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit architecture. The part name references operating points of 200 MHz and 1 GHz and the specifications list a 200 MHz speed entry.
Designed for industrial embedded systems, this device combines multi‑core processing, on‑chip security primitives, and a broad set of I/O interfaces to support connected control and display applications in industrial environments.
Key Features
- Core Architecture ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit configuration, providing a multi‑core platform for partitioned embedded workloads.
- Operating Speed Product naming references 200 MHz / 1 GHz and the specification includes a 200 MHz entry for operating speed.
- Memory Interfaces Built‑in controllers for DDR4 and DDR3L memory, enabling flexible system memory configurations.
- Multimedia Acceleration Includes NEON™ SIMD multimedia capabilities for SIMD acceleration of media and signal processing tasks.
- Display Support Integrated LCD display interface controller to drive visual user interfaces.
- Connectivity Dual Gigabit Ethernet ports and two USB 2.0 ports provide wired networking and peripheral connectivity; additional CANbus interface supports automotive‑style field networks in industrial systems.
- Security Features On‑chip security primitives including AES, ECC, GHASH, RSA, SHA‑1, SHA‑224, SHA‑256 and a True Random Number Generator (TRNG) for cryptographic operations and secure boot/communications.
- Industrial Qualification & Temperature Qualified for industrial use with an operating temperature range of −40 °C to 85 °C.
- Package & Mounting 361‑pin LFBGA / 361‑BGA (13 × 13 mm) surface‑mount package for compact board integration.
Typical Applications
- Industrial Control Systems Industrial qualification, CANbus and dual GbE make it suitable for control nodes and connected automation equipment.
- Human‑Machine Interfaces (HMI) Integrated LCD controller and NEON SIMD enable responsive graphical interfaces for operator panels.
- Secure Connected Devices Comprehensive cryptographic support (AES, RSA, ECC, SHA family, TRNG) supports secure communications and data protection.
- Edge Networking Appliances Dual Gigabit Ethernet and USB 2.0 interfaces provide the connectivity required for edge gateways and networking appliances in embedded deployments.
Unique Advantages
- Multi‑core, 64‑bit Architecture: Four cores in a 64‑bit configuration provide headroom for parallel processing and mixed workload designs.
- Rich Security Suite: Hardware AES, ECC, GHASH, RSA, SHA variants and TRNG enable integrated cryptography without external accelerators.
- Flexible Memory Support: DDR4 and DDR3L controller support simplifies memory selection across performance and power tradeoffs.
- Industrial‑Grade Robustness: Industrial qualification and −40 °C to 85 °C operating range support deployment in harsh environments.
- Broad Connectivity: Dual GbE, USB 2.0 and CANbus provide multiple high‑speed and field bus options for networked embedded systems.
Why Choose R9A07G043U11GBG#AC0?
The R9A07G043U11GBG#AC0 positions itself as a highly integrated embedded microprocessor combining ARM® Cortex®-A55 and Cortex®-M33 cores with industry‑grade qualification and extensive security features. Its mix of multi‑core processing, memory interface flexibility, and multiple wired connectivity options make it suitable for industrial embedded designs that require connectivity, display support, and on‑chip cryptography.
Engineers specifying the device benefit from a compact 361‑BGA package and an operating temperature range tailored for industrial deployments, enabling robust system integration without adding discrete accelerators for common cryptographic and multimedia tasks.
Request a quote or submit a pricing inquiry today to evaluate R9A07G043U11GBG#AC0 for your next industrial embedded design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
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