R9A07G043U11GBG#AC0

IC MPU RZ/G 200MHZ/1GHZ 361BGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G 4 Core, 64-Bit 200MHz, 1GHz 361-BGA (13x13)

Quantity 57 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G043
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package361-BGA (13x13)
Display & Interface ControllersLCDECCN3A991A2EthernetGbE (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersDDR4, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1GHzSupplier Device Package361-BGA (13×13)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G043U11GBG#AC0 – ARM® Cortex®-A55 / Cortex®-M33 4-Core 64‑Bit MPU (200MHz / 1GHz), 361‑BGA

The R9A07G043U11GBG#AC0 is a Renesas RZ/G series microprocessor integrating ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit architecture. The part name references operating points of 200 MHz and 1 GHz and the specifications list a 200 MHz speed entry.

Designed for industrial embedded systems, this device combines multi‑core processing, on‑chip security primitives, and a broad set of I/O interfaces to support connected control and display applications in industrial environments.

Key Features

  • Core Architecture  ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit configuration, providing a multi‑core platform for partitioned embedded workloads.
  • Operating Speed  Product naming references 200 MHz / 1 GHz and the specification includes a 200 MHz entry for operating speed.
  • Memory Interfaces  Built‑in controllers for DDR4 and DDR3L memory, enabling flexible system memory configurations.
  • Multimedia Acceleration  Includes NEON™ SIMD multimedia capabilities for SIMD acceleration of media and signal processing tasks.
  • Display Support  Integrated LCD display interface controller to drive visual user interfaces.
  • Connectivity  Dual Gigabit Ethernet ports and two USB 2.0 ports provide wired networking and peripheral connectivity; additional CANbus interface supports automotive‑style field networks in industrial systems.
  • Security Features  On‑chip security primitives including AES, ECC, GHASH, RSA, SHA‑1, SHA‑224, SHA‑256 and a True Random Number Generator (TRNG) for cryptographic operations and secure boot/communications.
  • Industrial Qualification & Temperature  Qualified for industrial use with an operating temperature range of −40 °C to 85 °C.
  • Package & Mounting  361‑pin LFBGA / 361‑BGA (13 × 13 mm) surface‑mount package for compact board integration.

Typical Applications

  • Industrial Control Systems  Industrial qualification, CANbus and dual GbE make it suitable for control nodes and connected automation equipment.
  • Human‑Machine Interfaces (HMI)  Integrated LCD controller and NEON SIMD enable responsive graphical interfaces for operator panels.
  • Secure Connected Devices  Comprehensive cryptographic support (AES, RSA, ECC, SHA family, TRNG) supports secure communications and data protection.
  • Edge Networking Appliances  Dual Gigabit Ethernet and USB 2.0 interfaces provide the connectivity required for edge gateways and networking appliances in embedded deployments.

Unique Advantages

  • Multi‑core, 64‑bit Architecture:  Four cores in a 64‑bit configuration provide headroom for parallel processing and mixed workload designs.
  • Rich Security Suite:  Hardware AES, ECC, GHASH, RSA, SHA variants and TRNG enable integrated cryptography without external accelerators.
  • Flexible Memory Support:  DDR4 and DDR3L controller support simplifies memory selection across performance and power tradeoffs.
  • Industrial‑Grade Robustness:  Industrial qualification and −40 °C to 85 °C operating range support deployment in harsh environments.
  • Broad Connectivity:  Dual GbE, USB 2.0 and CANbus provide multiple high‑speed and field bus options for networked embedded systems.

Why Choose R9A07G043U11GBG#AC0?

The R9A07G043U11GBG#AC0 positions itself as a highly integrated embedded microprocessor combining ARM® Cortex®-A55 and Cortex®-M33 cores with industry‑grade qualification and extensive security features. Its mix of multi‑core processing, memory interface flexibility, and multiple wired connectivity options make it suitable for industrial embedded designs that require connectivity, display support, and on‑chip cryptography.

Engineers specifying the device benefit from a compact 361‑BGA package and an operating temperature range tailored for industrial deployments, enabling robust system integration without adding discrete accelerators for common cryptographic and multimedia tasks.

Request a quote or submit a pricing inquiry today to evaluate R9A07G043U11GBG#AC0 for your next industrial embedded design.

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